Compact PIFA antenna
First Claim
1. A planar inverted-F antenna (PIFA), comprising:
- a printed circuit board (PCB) formed of an electrically insulating material with a low electrical conductivity, the PCB having a top surface and a bottom surface, and a thickness defined by a shortest distance between the top surface and the bottom surface;
an antenna element formed of an electrically conducting material with an electrical conductivity higher than that of the PCB, the antenna element disposed on the top surface of the PCB, the antenna element having a predetermined impedance bandwidth and a plurality of slots arranged to provide the antenna element with a surface area smaller than a surface area of an antenna element having the same impedance bandwidth but not having a plurality of slots, all other parameters relevant to the impedance bandwidth being equal;
a ground element formed of an electrically conducting material with an electrical conductivity higher than that of the PCB, the ground element disposed on the bottom surface of the PCB and operatively coupled to the antenna element, the ground element having a continuous perimeter defining a central area at least a portion of which comprises a layer formed of the electrically conducting material, the layer having;
(i) at least one internal opening, and (ii) at least one internal slot arranged to provide the ground element with a layer smaller than a layer of a ground element providing the same radiation efficiency but not having at least one internal slot and at least one internal opening, all other parameters relevant to the radiation efficiency being equal.
2 Assignments
0 Petitions
Accused Products
Abstract
Various planar inverted-F antenna configurations may include an antenna element formed on the top of a PCB and a ground element formed on the bottom of the PCB. Two or more slots may be included in the antenna element for reducing the antenna area while maintaining a suitable impedance bandwidth. A slot may be included in the ground element for reducing the ground area while increasing radiation efficiency. A folded ground may be formed on the top of the PCB for reducing system area while maintaining suitable performance. By moving the folded ground closer to the antenna element and increasing the PCB thickness, significant reductions in system area may be achieved, while maintaining or improving performance in terms of radiation pattern, radiation efficiency and impedance bandwidth.
977 Citations
21 Claims
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1. A planar inverted-F antenna (PIFA), comprising:
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a printed circuit board (PCB) formed of an electrically insulating material with a low electrical conductivity, the PCB having a top surface and a bottom surface, and a thickness defined by a shortest distance between the top surface and the bottom surface; an antenna element formed of an electrically conducting material with an electrical conductivity higher than that of the PCB, the antenna element disposed on the top surface of the PCB, the antenna element having a predetermined impedance bandwidth and a plurality of slots arranged to provide the antenna element with a surface area smaller than a surface area of an antenna element having the same impedance bandwidth but not having a plurality of slots, all other parameters relevant to the impedance bandwidth being equal; a ground element formed of an electrically conducting material with an electrical conductivity higher than that of the PCB, the ground element disposed on the bottom surface of the PCB and operatively coupled to the antenna element, the ground element having a continuous perimeter defining a central area at least a portion of which comprises a layer formed of the electrically conducting material, the layer having;
(i) at least one internal opening, and (ii) at least one internal slot arranged to provide the ground element with a layer smaller than a layer of a ground element providing the same radiation efficiency but not having at least one internal slot and at least one internal opening, all other parameters relevant to the radiation efficiency being equal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A planar inverted F antenna (PIFA) comprising:
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a printed circuit board (PCB) comprising opposing first and second surfaces; an antenna element disposed on the first surface, wherein the antenna element comprises a plurality of slots; and a ground element disposed on the second surface and coupled to the antenna element, wherein the ground element comprises; an additional slot defined in an electrically conducting interior region of the ground element; and at least one opening defined in an additional interior region, distinct from the electrically conducting interior region, of the ground element. - View Dependent Claims (18, 19, 20, 21)
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Specification