Sealing adhesive, its preparation method, and liquid crystal display device

• US 10,221,345 B2
• Filed: 03/30/2017
• Issued: 03/05/2019
• Est. Priority Date: 04/14/2016
• Status: Expired due to Fees

• Current Assignee: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectric Technology Co. Ltd. (BOE Technology Group Co., Ltd.)
• Original Assignee: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectric Technology Co. Ltd. (BOE Technology Group Co., Ltd.)
• Inventors: Zhang, Bo, Tan, Cong, Zhan, Chengyong
• Primary Examiner(s): Lee, Daniel H
• Application Number:
  US15/560,419
• Publication Number:
  US 20180187055A1
• Time in Patent Office: 705 Days
• CPC Class Codes: C08G 59/1477 containing nitrogen
• CPC Class Codes: C09J 11/06 organic
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09K 2200/0625 Polyacrylic esters or derivatives thereof
• CPC Class Codes: C09K 3/1021 Polyurethanes or derivatives thereof
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells

Abstract

Disclosed are a sealing adhesive and a method of making the same, and a liquid crystal display device. The sealing adhesive includes a modified epoxy compound obtained by chemical bonding of a piperidine compound with an epoxy compound, wherein the modified epoxy compound contains a nitrogen-hydrogen bond. The method of preparing the above sealing adhesive includes: subjecting a piperidine compound and an epoxy compound to a chemical reaction to obtain a modified epoxy compound; and mixing about 10 to 90 parts by eight of the modified epoxy compound, about 10 to 90 parts by weight of an acrylic resin, about 2 to 5 parts by weight of a filler, about 5 to 10 parts by weight of a heat curing agent and about 3 to 10 parts by weight of a photoinitiator to obtain a sealing adhesive. The liquid crystal display device includes the sealing adhesive described above.

Claims

1. A sealing adhesive, comprising a modified epoxy compound obtained by chemical bonding of a piperidine compound with an epoxy compound, wherein the modified epoxy compound contains a nitrogen-hydrogen bond, and the piperidine compound contains a carboxyl group.

2. The sealing adhesive according to claim 1, wherein the piperidine compound is a compound of Formula I:

3. The sealing adhesive according to claim 1, wherein the epoxy compound is a compound of Formula II:

4. The sealing adhesive according to claim 1, wherein the sealing adhesive comprises about 10 to 90 parts by weight of an acrylic resin and about 10 to 90 parts by weight of the modified epoxy compound.

5. The sealing adhesive according to claim 4, wherein the sealing adhesive further comprises about 2 to 5 parts by weight of a filler, about 5 to 10 parts by weight of a heat curing agent and about 3 to 10 parts by weight of a photoinitiator.

9. A liquid crystal display device, comprising the sealing adhesive according to claim 1.

10. A liquid crystal display device, comprising the sealing adhesive according to claim 2.

11. A liquid crystal display device, comprising the sealing adhesive according to claim 3.

12. A liquid crystal display device, comprising the sealing adhesive according to claim 4.

13. A liquid crystal display device, comprising the sealing adhesive according to claim 5.

6. A method of preparing a sealing adhesive, comprising:

a step of preparing a modified epoxy compound;

subjecting a piperidine compound and an epoxy compound to a chemical reaction to obtain a modified epoxy compound, wherein the piperidine compound contains a carboxyl group; and

a mixing step;

mixing about 10 to 90 parts by weight of the modified epoxy compound, about 10 to 90 parts by weight of an acrylic resin, about 2 to 5 parts by weight of a filler, about 5 to 10 parts by weight of a heat curing agent and about 3 to 10 parts by weight of a photoinitiator, to obtain the sealing adhesive.

7. The method according to claim 6, wherein the piperidine compound is a compound of Formula I:

8. The method according to claim 7, wherein the epoxy compound is a compound of formula II: