Infrared camera system architectures

• US 10,230,910 B2
• Filed: 07/31/2017
• Issued: 03/12/2019
• Est. Priority Date: 06/10/2011
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Boulanger, Pierre, Hoelter, Theodore R., Sharp, Barbara, Kurth, Eric A.
• Primary Examiner(s): Rao, Anand S
• Assistant Examiner(s): Edwards, Tyler B
• Application Number:
  US15/665,277
• Publication Number:
  US 20170359526A1
• Time in Patent Office: 589 Days
• Field of Search: None
• CPC Class Codes: G01J 5/00 Radiation pyrometry, e.g. infrared or optical thermometry
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: G01J 5/53 Reference sources, e.g. standard lamps; Black bodies
• CPC Class Codes: G06V 20/52 Surveillance or monitoring of activities, e.g. for recognising suspicious objects recognising microscopic objects G06V20/69
• CPC Class Codes: H04N 17/002 for television cameras
• CPC Class Codes: H04N 23/11 for generating image signals from visible and infrared light wavelengths
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/71 Circuitry for evaluating the brightness variation
• CPC Class Codes: H04N 23/74 by influencing the scene brightness using illuminating means
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20
• CPC Class Codes: H04N 7/18 Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast

Abstract

Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.

Claims

1. A device comprising:

an infrared imaging device comprising;

a housing configured to engage with a socket;

a focal plane array within the housing, wherein the focal plane array comprises a plurality of microbolometers, wherein each of the plurality of microbolometers is configured to capture infrared image data from a target scene; and

a logic circuit within the housing and configured to process the captured infrared image data.

2. The device of claim 1, further comprising a plurality of electrical connections on an inside surface of the housing and configured to pass electrical signals from the focal plane array to the logic circuit.

3. The device of claim 2, wherein at least a portion of the plurality of electrical connections protrudes from a bottom surface of the housing.

4. The device of claim 2, further comprising:

a first circuit board in electrical contact with the focal plane array and the plurality of electrical connections; and

a second circuit board in electrical contact with the logic circuit and the plurality of electrical connections,

wherein the plurality of electrical connections and the first and second circuit boards are configured to pass the electrical signals from the focal plane array to the logic circuit.

5. The device of claim 4, wherein the logic circuit is mounted to the second circuit board by flip chip connections and/or a plurality of wire bonds.

6. The device of claim 1, further comprising an optical element coupled to the housing and configured to pass infrared energy through to the focal plane array.

7. The device of claim 6, wherein the optical element comprises a lens, and wherein the lens is at least partially within the housing.

8. The device of claim 1, wherein the housing is configured to engage with the socket to secure the infrared imaging device within the socket when the infrared imaging device is inserted into a cavity of the socket.

9. The device of claim 1, wherein the device further comprises the socket, wherein the infrared imaging device is substantially within the socket, wherein the socket is coupled to the device such that the infrared imaging device is configured as an infrared camera for the device, and wherein the device is a portable host device.

10. The device of claim 9, wherein the portable host device is a mobile telephone.

11. The device of claim 1, further comprising a shutter adapted to be selectively positioned in front of the infrared imaging device to block infrared energy external to a host device from the focal plane array, wherein each of the plurality of microbolometers is configured to capture the infrared image data from a respective portion of the target scene, wherein the plurality of microbolometers forms an array of N microbolometers by M microbolometers, and wherein N and M are integers greater than or equal to 32 and less than or equal to 640.

12. A method of making the device of claim 1, the method comprising:

engaging the housing with the socket to secure the infrared imaging device within the socket; and

coupling the socket to a host device.

13. A method comprising:

passing infrared energy to an infrared imaging device of a device, wherein the infrared imaging device comprises a housing configured to engage with a socket;

capturing infrared image data associated with a target scene from the passed infrared energy through each of a plurality of microbolometers of a focal plane array within the housing; and

providing electrical signals from the focal plane array to a logic circuit within the housing.

14. The method of claim 13, wherein the electrical signals are provided through a plurality of electrical connections on an inside surface of the housing.

15. The method of claim 14, wherein the infrared imaging device further comprises:

a first circuit board in electrical contact with the focal plane array and the plurality of electrical connections; and

a second circuit board in electrical contact with the logic circuit and the plurality of electrical connections,

wherein the electrical signals are provided through the plurality of electrical connections, the first circuit board, and the second circuit board, and

wherein the logic circuit is mounted to the second circuit board by flip chip connections and/or a plurality of wire bonds.

16. The method of claim 13, wherein the passing comprises passing the infrared energy through an optical element coupled to the housing.

17. The method of claim 16, wherein the optical element comprises a lens, and wherein the lens is at least partially within the housing.

18. The method of claim 13, wherein the device further comprises the socket, wherein the infrared imaging device is substantially within the socket, wherein the socket is coupled to the device such that the infrared imaging device is configured as an infrared camera for the device, and wherein the device is a portable host device.

19. The method of claim 13, further comprising selectively positioning a shutter of the device in front of the infrared imaging device to block infrared energy external to the device from the focal plane array.

20. The method of claim 13, wherein the housing engages with the socket to secure the infrared imaging device within the socket when the infrared imaging device is inserted into a cavity of the socket.