Wireless power transmitter

• US 10,243,400 B2
• Filed: 12/02/2016
• Issued: 03/26/2019
• Est. Priority Date: 12/03/2015
• Status: Active Grant

• Current Assignee: Nera Innovations Limited (Atlantic IP Services Limited)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Park, Yu Ri
• Primary Examiner(s): Chang, Joseph
• Application Number:
  US15/367,945
• Publication Number:
  US 20170163091A1
• Time in Patent Office: 844 Days
• Field of Search: 307104
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices

Abstract

Embodiments provide a wireless power transfer technology, and more particularly, provide a wireless power transmitter, which may improve wireless power transfer efficiency, thereby achieving increased performance. The wireless power transmitter includes a Printed Circuit Board (PCB), a first transmission coil attached to a first surface of the PCB, a second transmission coil and a third transmission coil, each attached to a second surface of the PCB so as to overlap the first transmission coil, and a control circuit board for controlling wireless power transfer through the first to third transmission coils.

Claims

1. A wireless power transmitter comprising:

a Printed Circuit Board (PCB);

a first transmission coil attached to a first surface of the PCB;

a second transmission coil and a third transmission coil, each attached to a second surface of the PCB opposite to the first surface, both of the second and third transmission coils overlapping with the first transmission coil; and

a control circuit board for controlling wireless power transfer through the first to third transmission coils,

wherein the second transmission coil is spaced apart from the third transmission coil by a middle area without overlapping with the third transmission coil,

wherein the first transmission coil overlaps with the middle area and portions of the second and third transmission coils, and

wherein the control circuit board is configured to;

individually select an aligned coil among the first, second and third transmission coils for transmitting wireless power, and

control the aligned coil to transmit the wireless power without transmitting the wireless power via two unselected coils among the first, second and third transmission coils.

2. The wireless power transmitter according to claim 1, wherein the first surface is a surface facing an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface at an opposite side of the interface surface.

3. The wireless power transmitter according to claim 1, wherein the first surface is a surface at an opposite side of an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface facing the interface surface.

4. The wireless power transmitter according to claim 1, wherein each of the first to third transmission coils is formed by symmetrically etching both surfaces of a copper plate, and

wherein each of the first to third transmission coils is thicker than the PCB.

5. The wireless power transmitter according to claim 1, wherein each of the first to third transmission coils is connected to the control circuit board via a connector inserted into the PCB.

6. The wireless power transmitter according to claim 1, wherein the second transmission coil and the third transmission coil are spaced apart from each other, and

wherein an overlapping area between the first transmission coil and the second and third transmission coils is 50% or more of an entire area of the first transmission coil.

7. The wireless power transmitter according to claim 6, wherein the overlapping area between the first transmission coil and the second and third transmission coils is 90% or more of the entire area of the first transmission coil.

8. The wireless power transmitter according to claim 5, wherein the connector is located closest to the first transmission coil, among the first transmission coil, the second transmission coil and the third transmission coil.

9. The wireless power transmitter according to claim 1, wherein each of the first, second and third transmission coils is connected to two switches among a plurality of switches, and

wherein the plurality of switches are disposed between a signal generator and the first, second and third transmission coils.

10. A wireless power transmitter comprising:

a first layer including a first transmission coil;

a second layer including a second transmission coil and a third transmission coil;

a Printed Circuit Board (PCB) having a first surface and a second surface attached to the first layer and the second layer, respectively;

a control circuit board for controlling wireless power transfer through the first, second and third transmission coils; and

a connector inserted into the PCB, the connector electrically connecting the first, second and third transmission coils to the control circuit board,

wherein the connector is located closer to the first transmission coil than the second and third transmission coils.

11. The wireless power transmitter according to claim 10, wherein the first transmission coil included in the first layer and the second transmission coil included in the second layer overlap each other.

12. The wireless power transmitter according to claim 10, wherein the first, second and third transmission coils are formed by symmetrically etching both surfaces of a copper plate, and

wherein each of the first to third transmission coils is thicker than the PCB.

13. The wireless power transmitter according to claim 10, wherein the first surface is a surface facing an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface at an opposite side of the interface surface.

14. The wireless power transmitter according to claim 10, wherein the first surface is a surface at an opposite side of an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface facing the interface surface.

15. The wireless power transmitter according to claim 10,

wherein an overlapping area between the first transmission coil and the second and third transmission coils is 50% or more of an entire area of the first transmission coil.

16. The wireless power transmitter according to claim 15, wherein the overlapping area between the first transmission coil and the second and third transmission coils is 90% or more of the entire area of the first transmission coil.

17. The wireless power transmitter according to claim 10, wherein the second transmission coil and the third transmission coil are spaced apart from each other.

18. A wireless power transmitter comprising:

a Printed Circuit Board (PCB);

a first transmission coil disposed on a first surface of the PCB;

a second transmission coil and a third transmission coil, each disposed on a second surface of the PCB opposite to the first surface, both of the second and third transmission coils overlapping with the first transmission coil; and

a control circuit board for controlling wireless power transfer through the first to third transmission coils,

wherein the control circuit board is configured to;

individually select a best aligned coil among the first, second and third transmission coils for transmitting wireless power, and

control the best aligned coil to transmit the wireless power without transmitting the wireless power via two unselected coils among the first, second and third transmission coils.

19. The wireless power transmitter according to claim 18, wherein each of the first to third transmission coils is formed by symmetrically etching both surfaces of a copper plate, and

wherein each of the first to third transmission coils is thicker than the PCB.