Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus
First Claim
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1. A method for forming a cavity in a MEMS pressure sensor chip, comprising:
- forming a first groove in a substrate;
bonding a covering layer onto the substrate to cover the first groove, so as to form a cavity; and
etching the covering layer to lower the thickness of the covering layer,wherein the step of etching the covering layer further comprises;
patterning the covering layer to etch a portion of the covering layer corresponding to the cavity, with other portions of the covering layer remaining.
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Abstract
A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a2) on a substrate (a1); bonding a covering layer (a4) onto the substrate (a1) to cover the first groove (a2), thereby forming a cavity; and etching the covering layer (a4) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.
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9 Claims
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1. A method for forming a cavity in a MEMS pressure sensor chip, comprising:
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forming a first groove in a substrate; bonding a covering layer onto the substrate to cover the first groove, so as to form a cavity; and etching the covering layer to lower the thickness of the covering layer, wherein the step of etching the covering layer further comprises;
patterning the covering layer to etch a portion of the covering layer corresponding to the cavity, with other portions of the covering layer remaining. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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