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Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus

  • US 10,246,323 B2
  • Filed: 12/15/2015
  • Issued: 04/02/2019
  • Est. Priority Date: 04/28/2015
  • Status: Active Grant
First Claim
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1. A method for forming a cavity in a MEMS pressure sensor chip, comprising:

  • forming a first groove in a substrate;

    bonding a covering layer onto the substrate to cover the first groove, so as to form a cavity; and

    etching the covering layer to lower the thickness of the covering layer,wherein the step of etching the covering layer further comprises;

    patterning the covering layer to etch a portion of the covering layer corresponding to the cavity, with other portions of the covering layer remaining.

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