Fabrication of compound semiconductor structures
First Claim
1. A method for fabricating a compound semiconductor structure, the method comprising:
- providing a semiconductor substrate comprising a first semiconductor material;
forming an insulating layer on the semiconductor substrate;
forming an opening in the insulating layer, thereby exposing a seed surface of the substrate, the opening having sidewalls and a bottom, wherein the bottom corresponds to the seed surface of the substrate;
forming a cavity structure above the insulating layer, the cavity structure comprising the opening and a lateral growth channel extending laterally over the substrate;
growing a matching array on the seed surface of the substrate, the matching array comprising at least a first matching structure comprising a second semiconductor material and a second matching structure comprising a third semiconductor material;
growing the compound semiconductor structure comprising a fourth semiconductor material on a seed surface of the matching array;
wherein the first, the second, the third and the fourth semiconductor material are different from each other;
wherein;
the first matching structure provides a first matching level between the first and the second semiconductor material;
the second matching structure provides a second matching level between the second semiconductor material and the third semiconductor material; and
the compound semiconductor structure provides a third matching level between the third semiconductor material and the fourth semiconductor material;
wherein the first, the second and the third matching level address a plurality of matching parameters in a sequential way.
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Accused Products
Abstract
A semiconductor substrate, comprising a first semiconductor material, is provided and an insulating layer is formed thereon; an opening is formed in the insulating layer. Thereby, a seed surface of the substrate is exposed. The opening has sidewalls and a bottom and the bottom corresponds to the seed surface of the substrate. A cavity structure is formed above the insulating layer, including the opening and a lateral growth channel extending laterally over the substrate. A matching array is grown on the seed surface of the substrate, including at least a first semiconductor matching structure comprising a second semiconductor material and a second semiconductor matching structure comprising a third semiconductor material. The compound semiconductor structure comprising a fourth semiconductor material is grown on a seed surface of the second matching structure. The first through fourth semiconductor materials are different from each other. Corresponding semiconductor structures are also included.
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Citations
6 Claims
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1. A method for fabricating a compound semiconductor structure, the method comprising:
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providing a semiconductor substrate comprising a first semiconductor material; forming an insulating layer on the semiconductor substrate; forming an opening in the insulating layer, thereby exposing a seed surface of the substrate, the opening having sidewalls and a bottom, wherein the bottom corresponds to the seed surface of the substrate; forming a cavity structure above the insulating layer, the cavity structure comprising the opening and a lateral growth channel extending laterally over the substrate; growing a matching array on the seed surface of the substrate, the matching array comprising at least a first matching structure comprising a second semiconductor material and a second matching structure comprising a third semiconductor material; growing the compound semiconductor structure comprising a fourth semiconductor material on a seed surface of the matching array; wherein the first, the second, the third and the fourth semiconductor material are different from each other; wherein; the first matching structure provides a first matching level between the first and the second semiconductor material; the second matching structure provides a second matching level between the second semiconductor material and the third semiconductor material; and the compound semiconductor structure provides a third matching level between the third semiconductor material and the fourth semiconductor material; wherein the first, the second and the third matching level address a plurality of matching parameters in a sequential way. - View Dependent Claims (2, 3, 4, 5)
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6. A method for fabricating a compound semiconductor structure, the method comprising:
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providing a semiconductor substrate comprising a first semiconductor material; forming an insulating layer on the semiconductor substrate; forming an opening in the insulating layer, thereby exposing a seed surface of the substrate, the opening having sidewalls and a bottom, wherein the bottom corresponds to the seed surface of the substrate; forming a cavity structure above the insulating layer, the cavity structure comprising the opening and a lateral growth channel extending laterally over the substrate; growing a matching array on the seed surface of the substrate, the matching array comprising at least a first matching structure comprising a second semiconductor material and a second matching structure comprising a third semiconductor material; growing the compound semiconductor structure comprising a fourth semiconductor material on a seed surface of the matching array; wherein the first, the second, the third and the fourth semiconductor material are different from each other; further comprising; growing sequentially in the growth channel in an alternating way one or more first compound semiconductor structures of the fourth semiconductor material and one or more second compound semiconductor structures of a fifth semiconductor material, the fourth semiconductor material being different from the fifth semiconductor material, wherein the first compound semiconductor structures provide a seed surface for the second compound semiconductor structures and the second compound semiconductor structures provide a seed surface for the first compound semiconductor structures; and selectively etching the first or the second compound semiconductor structures, thereby forming a fin structure comprising a plurality of parallel fins of the first or the second compound semiconductor structures.
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Specification