MEMS device, liquid ejecting head, manufacturing method of MEMS device, and manufacturing method of liquid ejecting head
First Claim
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1. An MEMS device comprising:
- a first substrate provided with a driving element; and
a second substrate protecting the driving element are bonded to each other with an adhesive,wherein the driving element is formed inside a space surrounded by the adhesive between the first substrate and the second substrate,wherein an open hole which communicates with the space and an outside of the adhesive is formed in the adhesive, andwherein an end of an outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.
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Abstract
There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.
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Citations
6 Claims
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1. An MEMS device comprising:
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a first substrate provided with a driving element; and a second substrate protecting the driving element are bonded to each other with an adhesive, wherein the driving element is formed inside a space surrounded by the adhesive between the first substrate and the second substrate, wherein an open hole which communicates with the space and an outside of the adhesive is formed in the adhesive, and wherein an end of an outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification