Method of installing electronic component, display device and display system

• US 10,281,780 B2
• Filed: 09/27/2017
• Issued: 05/07/2019
• Est. Priority Date: 09/28/2016
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Furuta, Kaoru
• Primary Examiner(s): Cunningham, Xanthia C
• Application Number:
  US15/717,769
• Publication Number:
  US 20180088389A1
• Time in Patent Office: 587 Days
• Field of Search: None
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: G02F 1/13336 Combining plural substrates to produce large-area displays, e.g. tiled displays
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H05K 3/3463 Solder compositions in relation to features of the printed circuit board or the mounting process

Abstract

A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

Claims

1. A display device, comprising:

a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line;

an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and

a junction part that electrically joins the vertical end surface and the electronic component,

the junction part including a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

2. The display device according to claim 1, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material.

3. The display device according to claim 1, wherein the substrate side line connection part is a portion of the end of the line that is exposed in a space between the two substrates.

4. The display device according to claim 1, wherein the solder junction part has a thickness that is equal to or less than about 20 μ

m.

5. The display device according to claim 1, wherein a distance between adjacent substrate side line connection parts has a range of 10 to 100 μ

m.

6. A display system, comprising:

a first display device;

a second display device adjacent to the first display device along a first direction; and

a third display device adjacent to the first display device along a second direction,

wherein at least one of the first to third display devices includes;

a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line;

an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and

a junction part that electrically joins the vertical end surface and the electronic component,

the junction part including a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.

7. The display system according to claim 6, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material.