Skewed co-spiral inductor structure

• US 10,283,257 B2
• Filed: 01/08/2016
• Issued: 05/07/2019
• Est. Priority Date: 01/08/2016
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Kim, Daeik Daniel, Berdy, David Francis, Zuo, Chengjie, Yun, Changhan Hobie, Kim, Jonghae
• Primary Examiner(s): Lian, Mang Tin Bik
• Assistant Examiner(s): Barnes, Malcolm
• Application Number:
  US14/991,803
• Publication Number:
  US 20170200550A1
• Time in Patent Office: 1,215 Days
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 23/5222 Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 27/0207 Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H04B 1/40 Circuits

Abstract

A skewed, co-spiral inductor structure may include a first trace arranged in a first spiral pattern that is supported by a substrate. The skewed, co-spiral inductor structure may also include a second trace arranged in a second spiral pattern, in which the second trace is coupled to the first trace. The first trace may overlap with the second trace in orthogonal overlap areas. In addition, each orthogonal overlap area may have a size defined by a width of the first trace and the width of the second trace. Also, parallel edges of the first trace and the second trace may be arranged to coincide.

Claims

1. A skewed, co-spiral inductor structure, comprising:

a first trace arranged in a first spiral pattern supported by a substrate; and

a second trace arranged in a second spiral pattern, the second trace having a same width as the first trace and coupled to the first trace, the first trace overlapping with the second trace in a plurality of orthogonal overlap areas, each orthogonal overlap area having a size defined by the width of the first trace and the width of the second trace, each orthogonal overlap area orthogonal to an adjacent portion of the first trace and an adjacent portion of the second trace, in which each straight, parallel edge of the first trace and the second trace partially overlaps by a predetermined amount in a reduced footprint of the co-spiral inductor structure.

2. The co-spiral inductor structure of claim 1, in which a total of the plurality of orthogonal overlap areas is less than 10 percent of a first trace area and/or a second trace area.

3. The co-spiral inductor structure of claim 1, in which the first trace comprises a first spiral inductor and the second trace comprises a second spiral inductor arranged in a direction opposite and offset from the first spiral inductor.

4. The co-spiral inductor structure of claim 1, further comprising a via coupling the first trace to the second trace at a center portion of the co-spiral inductor structure.

5. The co-spiral inductor structure of claim 1, in which the second trace extends from a center portion of the co-spiral inductor structure according to the second spiral pattern in an opposite direction and offset from the first spiral pattern to reduce the plurality of overlap areas.

6. The co-spiral inductor structure of claim 1, in which the co-spiral inductor structure self-resonates at a frequency greater than an RF band.

7. The co-spiral inductor structure of claim 6, in which the frequency is greater than 2.4 GHz.

8. The co-spiral inductor structure of claim 1, in which the substrate comprises a glass substrate or a coreless substrate.

9. The co-spiral inductor structure of claim 1, in which a thickness of the first trace is within a range of ten (10) to twenty (20) micrometers.

10. The co-spiral inductor structure of claim 1, integrated into a radio frequency (RF) front end module, the RF front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.

11. A skewed, co-spiral inductor structure, comprising:

a first trace arranged in a first spiral pattern supported by a substrate; and

a second trace arranged in a second spiral pattern, the second trace having a same width as the first trace and coupled to the first trace, the first trace overlapping with the second trace in a plurality of orthogonal overlap areas, each of the plurality of orthogonal overlap areas having a size defined by the width of the first trace and the width of the second trace, each orthogonal overlap area orthogonal to an adjacent portion of the first trace and an adjacent portion of the second trace, in which each straight, parallel edge of the first trace and the second trace partially overlaps by a predetermined amount up to 20% in a reduced footprint of the skewed, co-spiral inductor structure.

12. The co-spiral inductor structure of claim 11, in which a thickness of the first trace is within a range of ten (10) to twenty (20) micrometers.

13. The co-spiral inductor structure of claim 11, in which the width of the first trace and the width of the second trace is within a range of twenty (20) to one hundred (100) micrometers.

14. The co-spiral inductor structure of claim 11, in which a spacing between the second trace and the first trace is within a range of three (3) to ten (10) micrometers.

15. The co-spiral inductor structure of claim 11, in which the first trace comprises a first spiral inductor and the second trace comprises a second spiral inductor arranged in a direction opposite and offset from the first spiral inductor.

16. The co-spiral inductor structure of claim 11, in which a total number of turns of the first trace is at least 1.5 turns.

17. The co-spiral inductor structure of claim 11, in which the first trace is comprised of a material selected from a group consisting of copper, aluminum, nickel, silver, silver paste, or copper paste.

18. The co-spiral inductor structure of claim 11, in which the substrate comprises a glass substrate, a semiconductor substrate, a core laminate substrate, a coreless substrate or a printed circuit board (PCB) substrate.

19. The co-spiral inductor structure of claim 11, integrated into a radio frequency (RF) front end module.

20. The co-spiral inductor structure of claim 19, in which the RF front end module is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.

21. A skewed, co-spiral inductor structure, comprising:

means for supporting;

a first trace arranged in a first spiral pattern on the supporting means;

a second trace arranged in a second spiral pattern, the second trace having a same width as the first trace, the first trace overlapping with the second trace in a plurality of orthogonal overlap areas, each orthogonal overlap area having a size defined by the width of the first trace and the width of the second trace, each orthogonal overlap area orthogonal to an adjacent portion of the first trace and an adjacent portion of the second trace, in which straight, parallel edge of the first trace and the second trace partially overlaps by a predetermined amount in a reduced footprint of the skewed, co-spiral inductor structure; and

means for electrically coupling the second trace to the first trace.

22. The co-spiral inductor structure of claim 21, in which a thickness of the first trace is within a range of ten (10) to twenty (20) micrometers.

23. The co-spiral inductor structure of claim 21, in which the width of the first trace and the width of the second trace is within a range of twenty (20) to one hundred (100) micrometers.

24. The co-spiral inductor structure of claim 21, in which a spacing between the second trace and the first trace is within a range of three (3) to ten (10) micrometers.

25. The co-spiral inductor structure of claim 21, integrated into a radio frequency (RF) front end module, the RF front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.