Chip encapsulating method and chip encapsulating structure

  • US 10,283,376 B2
  • Filed: 04/12/2018
  • Issued: 05/07/2019
  • Est. Priority Date: 07/03/2017
  • Status: Active Grant
First Claim
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1. A chip encapsulating method, comprising:

  • fixing a plurality of wafers to a first panel level substrate, a wafer comprising a plurality of chips;

    forming a re-distribution layer on the wafer for each of the chips;

    forming each individual chip and the re-distribution layer connected to the chip by cutting;

    fixing the chip and the re-distribution layer connected to the chip to a second panel level substrate; and

    encapsulating the chip to form an encapsulating layer.

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