Computer controlled work tool apparatus and method

• US 10,289,096 B2
• Filed: 03/14/2018
• Issued: 05/14/2019
• Est. Priority Date: 08/24/2007
• Status: Active Grant

• Current Assignee: Zeeko Limited
• Original Assignee: Zeeko Limited
• Inventors: Walker, David, Beaucamp, Anthony, Dunn, Christina Reynolds
• Primary Examiner(s): Hartman, Jr, Ronald D
• Application Number:
  US15/920,664
• Publication Number:
  US 20180203432A1
• Time in Patent Office: 426 Days
• CPC Class Codes: B24B 13/06 grinding of lenses, the tool or work being controlled by information-carrying means, e.g. patterns, punched tapes, magnetic tapes
• CPC Class Codes: B24D 13/142 Wheels of special form
• CPC Class Codes: G05B 19/4099 Surface or curve machining, making 3D objects, e.g. desktop manufacturing
• CPC Class Codes: G05B 19/4103 Digital interpolation
• CPC Class Codes: G05B 2219/34105 Area pocket machining, space filling curve, to cover whole surface
• CPC Class Codes: G05B 2219/34118 Using a pseudo-random or random tool path
• CPC Class Codes: G05B 2219/34141 B-spline, NURBS non uniform rational b-spline
• CPC Class Codes: G05B 2219/35122 Generate random paths along a raster path
• CPC Class Codes: G05B 2219/45157 Grind optical lens
• CPC Class Codes: G05B 2219/45199 Polish
• CPC Class Codes: G05B 2219/45232 CMP chemical mechanical polishing of wafer
• CPC Class Codes: G05B 2219/49352 7-Axis surface machining

Abstract

A polishing machine is described in which a surface treatment tool is moved across the surface of a workpiece in accordance with a predefined tool-path, in order to carry out the desired treatment process. The tool-path is non-periodic and preferably pseudo-random. Various techniques are described for generating data representing the tool-path to be followed. A technique is also described for determining optimum control parameters used to control the polishing machine for a given tool-path. The surface treatment may be a shaping technique in which material is removed from the surface, or a technique for adding material to the surface of the workpiece, or a technique for modifying the surface or a region under the surface of the workpiece.

Claims

1. An apparatus for performing a surface treatment on an area of a workpiece, the apparatus comprising:

a surface treatment tool having a treatment footprint;

a tool-path generator comprising;

a memory configured to store surface model data defining a three-dimensional (3D) surface area of a workpiece to be worked;

a rules database comprising a plurality of rules relating to tool-path generation; and

a tool-path determiner configured to determine data representing a 3D tool-path along the 3D surface of the workpiece area to be worked in accordance with rules from said rules database, wherein said surface model data defines said surface in a two-dimensional (2D) projection and wherein said tool-path determiner is configured to determine data representing a 2D path within said 2D projection and is configured to project the data representing said 2D path into 3D to define said data representing said 3D tool-path; and

means to move the surface treatment tool relative to the workpiece along the determined 3D tool path such that the footprint of the treatment tool passes over all points of the area.

2. An apparatus according to claim 1, wherein said surface model data is configured to define said surface using two-dimensional parametric polynomials, wherein said tool-path determiner is configured to determine data representing a 2D path within a 2D space of said parametric polynomials and is configured to use said parametric polynomials to convert said data representing said 2D path into said data representing said 3D tool-path.

3. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine said data representing said 2D path using one or more predetermined stippling patterns.

4. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine said data representative of said 2D path using adaptive isocurves in accordance with rules in said rules database.

5. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine said data representative of said 2D path using a random walk algorithm in accordance with rules in said rules database.

6. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine said data representative of said 2D path using an artificial ant algorithm in accordance with rules in said rules database.

7. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine said data representative of said 2D path on the basis of a maze algorithm in accordance with rules in said rules database.

8. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine said data representative of said 2D path using a genetic algorithm in accordance with rules in said rules database.

9. An apparatus according to claim 2, wherein said data representative of said 2D path comprises a sequence of 2D points and wherein the tool-path determiner is configured to determine said data representing said pseudo-random tool-path by converting said sequence of 2D points into 3D points using said parametric polynomials.

10. An apparatus according to claim 9, wherein said tool-path determiner is configured to determine lines and/or curves between successive 3D points obtained from said parametric polynomials to determine said data representing said 3D tool-path.

11. An apparatus according to claim 9, wherein said tool-path determiner is configured to fit a curve to said 3D points in order to determine said data representing said 3D tool-path.

12. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine a sequence of points within said 2D space, which 2D points identify control points for a plurality of spline segments that define said 2D path.

13. An apparatus according to claim 12, wherein said surface model data represents said surface using two-dimensional non-uniform rational B-splines and wherein said control points are control points for a non-uniform rational B-spline.

14. An apparatus according to claim 2, wherein said data representative of said 2D path comprises 2D coordinate positions for a sequence of points randomly positioned within said 2D space.

15. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine data representing said 2D path comprising a sequence of points positioned in said 2D space in accordance with a distribution function defined by rules in said rules database.

16. An apparatus according to claim 15, wherein said rules define a weighted distribution function which causes said tool-path determiner to determine more 2D points at positions in said 2D space corresponding to boundaries of said area of said workpiece.

17. An apparatus according to claim 2, wherein said surface model data includes data identifying an amount of work to be carried out on different parts of said area of said workpiece and wherein said tool-path determiner is configured to determine data representing said 2D path comprising a sequence of points distributed within said 2D space in dependence upon the amount of work to be carried out in the different parts of the area.

18. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine data representative of a 2D path which does not cross itself within said 2D space.

19. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine data representing said 2D path using a uniformly-spaced lattice of points within said 2D space.

20. An apparatus according to claim 2, wherein said tool-path determiner is configured to define said data representative of said 2D path using a lattice of points in which the spacing between lattice points depends on an amount of work to be performed in a corresponding portion of said surface.

21. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine data representing a plurality of 2D paths and wherein said tool-path definer is configured to select one or more of said 2D paths in accordance with a predetermined selection process.

22. An apparatus according to claim 21, wherein said tool-path determiner is configured to select said one or more 2D paths using artificial intelligence techniques in accordance with rules in said rules database.

23. An apparatus according to claim 21, wherein said tool-path determiner is configured to evaluate estimated effects of a tool working said surface along tool-paths corresponding to each possible 2D path and configured to select one or more of said 2D paths on the basis of that evaluated estimated effects.

24. An apparatus according to claim 2, wherein said tool-path determiner is configured to determine data representing said 3D tool-path which comprises 3D coordinates of a sequence of points along said tool-path.

25. An apparatus according to claim 24, wherein said tool-path determiner is configured to determine lines and/or curves between successive points within said sequence of points in order determine said data representing said 3D tool-path.

26. An apparatus according to claim 24, wherein said tool-path determiner is configured to fit a curve to said sequence of points in order to determine said data representating said 3D tool-path.

27. An apparatus according to claim 1, wherein said tool-path determiner is configured to determine data representing a pseudo-random 3D tool-path.

28. An apparatus according to claim 1 wherein said 3D tool-path does not cross itself.

29. An apparatus according to claim 1, wherein said tool-path determiner is configured to determine data representing a pseudo-random tool-path in which the transverse distance between neighbouring stretches of the path is arranged to be within a predetermined range of distances.

30. An apparatus according to claim 1, wherein said tool-path determiner is configured to determine data representing a 3D tool-path in which the transverse distance between neighbouring stretches of the path is substantially the same for all or substantially all points on the path.

31. An apparatus according to claim 1, wherein the surface treatment tool is capable of working on or under the surface of a workpiece.

32. An apparatus according to claim 1, wherein the 3-D tool-path is arranged so that, from a tool-path point which is within a first predetermined distance of a boundary of the area, the tool-path may not proceed in a direction within a predetermined angular range from the normal joining the boundary to that tool-path point.

33. An apparatus according to claim 1, wherein the tool-path is arranged so that, from a tool-path point on a boundary of the area, the tool-path may only proceed in a direction away from the boundary and within a predetermined angular range from the normal to the workpiece boundary.

34. An apparatus according to claim 1 wherein said means to move the surface treatment tool relative to the workpiece comprises a controller configured to control relative movement between the workpiece and the tool to cause the tool to follow the 3-D tool-path across said surface of the workpiece to effect a time-dependent cumulative action on or under said surface.

35. An apparatus according to claim 34, wherein said controller is configured to control the values of one or more controllable parameters of the apparatus to control the treatment of the workpiece along said tool-path, to cause the apparatus to vary the treatment of said surface at different locations along said tool-path.

36. An apparatus according to claim 35, wherein the controller comprises an optimiser configured to optimise control parameters used to control the working of the workpiece along said tool-path.

37. An apparatus according to claim 36, wherein the surface treatment tool is a tool for removing material from the workpiece surface, and wherein said optimiser is configured to use data defining an influence function of the tool, and data defining a desired profile and a current profile of the surface of the workpiece.

38. An apparatus according to claim 37, wherein said controller is configured to determine dwell times or tool speeds for predetermined positions on said surface of the workpiece to provide a predicted removal profile and is configured to vary the dwell times or tool speeds and other controllable parameters of the tool using a numerical optimisation process to determine control parameters and dwell times or tool speeds along said tool path that will minimise an estimated error between said desired profile and the profile of the surface after said tool has performed said polishing or abrading along said tool path.

39. An apparatus according to claim 1, wherein said treatment comprises one or more of:

the removal of material from the surface of said workpiece;

abrading or polishing the workpiece;

the addition of material to the surface of said workpiece; and

the modification of the surface or a region under the surface of said workpiece.

40. A method for performing a surface treatment on an area of a workpiece by moving a surface treatment device having a treatment footprint over the area;

the method comprising;

generating a 3D tool-path which visits all points of the area, in a tool-path generator comprising;

a memory configured to store surface model data defining a three-dimensional (3D) surface of the area to be worked;

a rules database comprising a plurality of rules relating to tool-path generation; and

a tool-path determiner configured to determine data representing a 3D tool path along the surface of the area of the workpiece to be worked in accordance with rules from said rules database, wherein said surface model data defines said surface in a two-dimensional (2D) projection and wherein said tool-path determiner is configured to determine data representing a 2D path within said 2D projection and is configured to project the data representing said 2D path into 3D to define said data representing said 3D tool-path; and

moving the surface treatment device along the 3D tool-path such that the footprint of the treatment tool passes over all points of the area.

41. A method according to claim 40, wherein the path is a random or pseudo-random path.

42. A method according to claim 40, wherein the 3D tool-path visits all points of the area without visiting any point twice.

43. A method according to claim 40, wherein the transverse distance between neighbouring stretches of the 3D tool-path is arranged to be within a predetermined range of distances.

44. A method according to claim 40, wherein the 3D tool-path is arranged so that the transverse distance between neighbouring stretches of the path is substantially the same for all or substantially all points on the path.

45. A method of manufacturing a semiconductor device comprising shaping or treating a silicon wafer using a method according to claim 40, and manufacturing the semiconductor device from the shaped or treated wafer.

46. A method of manufacturing a display device comprising shaping or treating a screen component using a method according to claim 40, and including the screen component in the display device.

47. A method of manufacturing an optical device comprising shaping or treating an optical component using a method according to claim 40, and manufacturing the optical device using the shaped or treated optical component.

48. A method according to claim 47, wherein the optical component is a lens or a mirror.