Organic modified silicone resin composition

• US 10,294,346 B2
• Filed: 11/25/2014
• Issued: 05/21/2019
• Est. Priority Date: 01/28/2014
• Status: Active Grant

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Tabei, Eiichi, Harada, Yoshifumi
• Primary Examiner(s): Stanley, Jane L
• Application Number:
  US15/110,593
• Publication Number:
  US 20160326340A1
• Time in Patent Office: 1,638 Days
• Field of Search: 524862
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/18 to alkoxy or aryloxy groups
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/50 by carbon linkages C08G77/485 takes precedence
• CPC Class Codes: C08G 77/52 containing aromatic rings
• CPC Class Codes: C08G 77/60 in which all the silicon atoms are connected by linkages other than oxygen atoms
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08K 5/56 Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/14 in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms C08L83/10 takes precedence
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29386 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/05442 SiO2
• CPC Class Codes: H01L 2924/0715 Polysiloxane
• CPC Class Codes: H01L 2924/12041 LED

Abstract

An organic modified silicone resin composition includes: (A) an addition reaction product having two addition reactive carbon-carbon double bonds in one molecule, being a product of an addition reaction of (a) a compound shown by the general formula (1) having SiH groups and (b) a polycyclic hydrocarbon having addition reactive carbon-carbon double bonds; (B) a siloxane having an SiH group and an organic group substituted with an alkoxysilyl group and/or a siloxane having an SiH group and an organic group substituted with an epoxy group; (C) a compound having three or more SiH groups in one molecule; (D) a catalyst; and (E) fumed inorganic oxide. The formulation amount of the component (E) is 1 to 10 parts by mass relative to 100 parts by mass of the total amount of the components (A), (B), and (C); and having a viscosity of 10 to 100 Pa·s at 25° C.

Claims

1. An organic modified silicone resin composition comprising:

(A) an addition reaction product having two addition reactive carbon-carbon double bonds in one molecule, being a product of an addition reaction of

(a) a compound shown by the following general formula (1), having two silicon atom-bonded hydrogen atoms in one molecule,

2. The organic modified silicone resin composition according to claim 1, wherein the (b) polycyclic hydrocarbon is either or both of 5-vinylbicyclo [2.2.1]hept-2-ene and 6-vinylbicyclo[2.2.1]hept-2-ene.

3. The organic modified silicone resin composition according to claim 2, wherein the Shore D hardness of a cured product of the organic modified silicone resin composition is 60 or more.

4. The organic modified silicone resin composition according to claim 2, wherein the component (C) is a compound having a cyclic siloxane structure.

5. The organic modified silicone resin composition according to claim 4, wherein the component (C) is an addition reaction product of 1,3,5,7-tetramethylcyclotetrasiloxane and either or both of 5-vinylbicyclo[2.2.1]hept-2-ene and 6-vinylbicyclo [2.2.1]hept-2-ene.

6. The organic modified silicone resin composition according to claim 1, wherein the component (C) is a compound having a cyclic siloxane structure.

7. The organic modified silicone resin composition according to claim 6, wherein the Shore D hardness of a cured product of the organic modified silicone resin composition is 60 or more.

8. The organic modified silicone resin composition according to claim 6, wherein the component (C) is an addition reaction product of 1,3,5,7-tetramethylcyclotetrasiloxane and either or both of 5-vinylbicyclo[2.2.1]hept-2-ene and 6-vinylbicyclo [2.2.1]hept-2-ene.

9. The organic modified silicone resin composition according to claim 8, wherein the Shore D hardness of a cured product of the organic modified silicone resin composition is 60 or more.

10. The organic modified silicone resin composition according to claim 1, wherein the Shore D hardness of a cured product of the organic modified silicone resin composition is 60 or more.

11. The organic modified silicone resin composition according to claim 1, wherein the amount of component (E) is 2 to 8 parts by mass relative to 100 parts by mass of the total amount of the components (A), (B), and (C).