Camera module
First Claim
Patent Images
1. A camera module, comprising:
- a housing;
a lens module, wherein at least a portion of the lens module is disposed in an inner space of the housing;
a PCB disposed under the lens module;
an image sensor disposed on an upper surface of the PCB; and
a subsidiary substrate electrically connected to the PCB and disposed above the PCB,wherein the subsidiary substrate is disposed to be inclined with respect to the upper surface of the PCB,wherein the housing comprises a groove formed on a lower surface of the housing and that is recessed to receive the subsidiary substrate,wherein the groove of the housing is spaced apart from the inner space of the housing, andwherein at least a portion of the lens module is overlapped with the subsidiary substrate in a horizontal direction.
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Accused Products
Abstract
Disclosed is a vehicular camera module having an improved printed circuit board arrangement to downsize the apparatus. A printed circuit board according to one embodiment of the present invention has an image sensor and at least one connector arranged thereon, and can comprise at least one auxiliary substrate connected to the printed circuit board at a predetermined angle by the connector, and an housing attached to the printed circuit board.
52 Citations
19 Claims
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1. A camera module, comprising:
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a housing; a lens module, wherein at least a portion of the lens module is disposed in an inner space of the housing; a PCB disposed under the lens module; an image sensor disposed on an upper surface of the PCB; and a subsidiary substrate electrically connected to the PCB and disposed above the PCB, wherein the subsidiary substrate is disposed to be inclined with respect to the upper surface of the PCB, wherein the housing comprises a groove formed on a lower surface of the housing and that is recessed to receive the subsidiary substrate, wherein the groove of the housing is spaced apart from the inner space of the housing, and wherein at least a portion of the lens module is overlapped with the subsidiary substrate in a horizontal direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A camera module, comprising:
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a housing; a lens module coupled to the housing; a PCB disposed under the lens module; an image sensor disposed on an upper surface of the PCB; and a subsidiary substrate electrically connected to the PCB and disposed above the PCB, wherein the subsidiary substrate is disposed to be inclined with respect to the upper surface of the PCB, wherein the housing comprises a groove formed on a lower surface of the housing and that is recessed to receive the subsidiary substrate, wherein the groove of the housing is spaced apart from the lens module, and wherein at least a portion of the lens module is overlapped with the subsidiary substrate in a horizontal direction.
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Specification