Waveguide assembly comprising a molded waveguide interface having a support block for a launch transducer that is coupled to a communication device through a flange attached to the interface

• US 10,320,047 B2
• Filed: 12/21/2017
• Issued: 06/11/2019
• Est. Priority Date: 08/19/2009
• Status: Active Grant

• Current Assignee: Vubiq Networks, Inc.
• Original Assignee: Vubiq Networks, Inc.
• Inventors: Pettus, Michael Gregory
• Primary Examiner(s): Lee, Benny T
• Application Number:
  US15/850,525
• Publication Number:
  US 20180115045A1
• Time in Patent Office: 537 Days
• Field of Search: 333 26
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/49433 outside the semiconductor or solid-state body
• CPC Class Codes: H01P 1/042 Hollow waveguide joints
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions

Abstract

A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed.

Claims

1. A waveguide interface comprising:

a monolithic molded device comprising a support block configured to support a printed circuit board assembly and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange.

2. The waveguide interface of claim 1, wherein the support block and the interface are formed from a moldable metal alloy.

3. The waveguide interface of claim 1, wherein the support block and interface comprise a plurality of draft angles along one or more surfaces of the support block and the interface to allow for removal from a mold.

4. A waveguide assembly comprising:

a monolithic molded waveguide interface comprising a support block having a printed circuit board assembly affixed thereto and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly;

a launch transducer comprising one or more transmission lines in a first portion of the launch transducer and at least one transducer element coupled to the one or more transmission lines in a second portion of the launch transducer, wherein the at least one transducer element is configured to propagate millimeter wave frequency signals;

a communication device coupled to the printed circuit board assembly, wherein the launch transducer is positioned adjacent to and coupled to the communication device; and

a waveguide flange coupled to the interface of the waveguide interface, the waveguide flange having a waveguide opening, wherein the interface has one or more holes positioned to receive attachment devices to secure the waveguide flange to the interface.

5. The waveguide assembly of claim 4, wherein the interface is positioned flush against the waveguide flange such that a narrow dimension of the slot within the interface is orthogonal to an H-field dimension of the waveguide flange.

6. The waveguide assembly of claim 4, wherein the first portion of the launch transducer is positioned within the slot within the interface such that the slot prevents energy from the transmission line from being emitted toward the printed circuit board or the waveguide opening and allows energy to pass from the at least one transducer element into the waveguide opening.

7. The waveguide assembly of claim 4, wherein the communication device is configured to transmit and receive millimeter wave signals.

8. The waveguide assembly of claim 4, wherein the launch transducer further comprises a low-loss dielectric material with deposited metallization.

9. The waveguide assembly of claim 4, wherein the second portion of the launch transducer is positioned within the waveguide opening.

10. The waveguide assembly of claim 4, wherein the launch transducer is positioned near a top surface of the support block midway between opposing edges of the top surface of the support block.

11. The waveguide assembly of claim 4, wherein the communication device is positioned within a recess in the printed circuit board such that the first portion of the launch transducer is at a predetermined height within the slot within the interface.

12. The waveguide assembly of claim 4, wherein the launch transducer is positioned to provide maximum energy propagation along a central axis of the waveguide interface.

13. The waveguide assembly of claim 4, wherein the launch transducer has an operating frequency range between 57 GHz to 66 GHz.

14. The waveguide assembly of claim 4, wherein the slot within the interface comprises sidewalls having a draft angle of about two degrees, wherein the draft angle impacts transmission of millimeter waveguide energy into the waveguide opening by less than one percent.