Electronic device with encapsulated circuit assembly having an integrated metal layer
First Claim
1. A circuit assembly for an electronic device, comprising:
- a printed circuit board;
a group of electrical components attached to a surface of the printed circuit board;
a molded structure encapsulating the group of electrical components and at least a portion of the surface of the printed circuit board; and
a metal layer formed over an outer surface of the molded structure and defining;
a shield portion configured to provide shielding for one or more of the group of electrical components; and
an electrode electrically isolated from the shield portion and configured to detect an input applied to the electronic device.
1 Assignment
0 Petitions
Accused Products
Abstract
Embodiments are directed to a circuit assembly for an electronic device having an electromagnetic shield that defines a sensing element or contact pad along an outer surface of the assembly. The circuit assembly includes a group of electrical components attached to a surface of a printed circuit board. A molded structure may encapsulate the group of electrical components and at least a portion of the surface of the printed circuit board. A metal layer may be formed over an outer surface of the molded structure. The metal layer may define both a shield portion configured to provide shielding for one or more of the group of electrical components and an electrode configured to detect an input applied to the electronic device.
61 Citations
20 Claims
-
1. A circuit assembly for an electronic device, comprising:
-
a printed circuit board; a group of electrical components attached to a surface of the printed circuit board; a molded structure encapsulating the group of electrical components and at least a portion of the surface of the printed circuit board; and a metal layer formed over an outer surface of the molded structure and defining; a shield portion configured to provide shielding for one or more of the group of electrical components; and an electrode electrically isolated from the shield portion and configured to detect an input applied to the electronic device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A wearable electronic device, comprising:
-
an enclosure; and a circuit assembly positioned within the enclosure and comprising; a printed circuit board; a group of electrical components attached and electrically coupled to the printed circuit board; a molded structure encapsulating the group of electrical components; and a metal layer formed over the molded structure and defining; an electromagnetic shield for one or more electrical components of the group of electrical components; and an electrode electrically isolated from the electromagnetic shield and configured to electrically couple to an electrical component of the wearable electronic device that is distinct from the circuit assembly. - View Dependent Claims (11, 12, 13, 14, 15, 16)
-
-
17. A method of forming a circuit assembly, comprising:
-
forming a molded structure over a group of electrical components positioned along a printed circuit board to encapsulate the group of electrical components within the molded structure; and forming a metal layer along an outer surface of the molded structure to define; (1) an electrode electrically coupled to the group of electrical components, and (2) a shield portion electrically isolated from the electrode and configured to shield the group of electrical components from electromagnetic interference. - View Dependent Claims (18, 19, 20)
-
Specification