Liquid cooling

• US 10,330,395 B2
• Filed: 11/21/2017
• Issued: 06/25/2019
• Est. Priority Date: 01/31/2013
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Inventors: Franz, John P., Cader, Tahir, Sabotta, Michael L., Moore, David A.
• Primary Examiner(s): Hwu, Davis D
• Application Number:
  US15/819,463
• Publication Number:
  US 20180094875A1
• Time in Patent Office: 581 Days
• Field of Search: 165185
• CPC Class Codes: F28F 1/40 the means being only inside the tubular element
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20781 within cabinets for removing heat from server blades

Abstract

An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Claims

1. A device to provide liquid cooling, the device comprising:

a thermal member including a thermally conductive surface connected to the thermal member, wherein the thermal member is configured to receive heat transferred from an electronic device via a dry disconnect between the electronic device and the thermal member;

at least one support member including;

an inlet channel to provide a fluid to the thermally conductive surface; and

an outlet channel to transport the fluid from the thermally conductive surface;

a cooling channel facilitated by the thermal member and the at least one support member, the cooling channel having a fluid tight seal.

2. The device of claim 1, wherein the thermally conductive surface is located in the cooling channel.

3. The device of claim 1, wherein heat is transferred from the electronic device to the thermally conductive surface located in the cooling channel.

4. The device of claim 3, wherein the heat transferred from the electronic device to the thermally conductive surface is transferred from the thermally conductive surface to the fluid of the device.

5. The device of claim 1, wherein the device includes a mating member such that the heat from the electronic device is transferred from the electronic device to the thermal member of the device via the mating member of the device.

6. The device of claim 1, wherein the thermally conductive surface is a solid protrusion.

7. The device of claim 1, wherein the inlet channel receives the fluid and transports the fluid to the cooling channel.

8. The device of claim 1, wherein the outlet channel receives the fluid from the cooling channel and transports the fluid out of the cooling channel.

9. A cooling system, comprising:

a thermal member including a thermally conductive surface connected to the thermal member, wherein the thermal member is configured to receive heat transferred from an electronic device via a dry disconnect between the electronic device and the thermal member;

at least one support member including;

an inlet channel to provide a fluid to the thermally conductive surface; and

an outlet channel to transport the fluid from the thermally conductive surface; and

a cooling channel facilitated by the thermal member and the at least one support member, the cooling channel having a fluid tight seal;

wherein heat is transferred from the electronic device to the thermally conductive surface located in the cooling channel and to the fluid of the cooling system in response to the fluid flowing around the thermally conductive surface to cool the electronic device.

10. The cooling system of claim 9, wherein the heat is transferred from a heat block of the electronic device to the fluid via a mating member of the cooling system, to the thermally conductive surface, and to the fluid.

11. The cooling system of claim 10, wherein the mating member is adjacent to the heat block of the electronic device such that the mating member receives the heat from the heat block of the electronic device.

12. The cooling system of claim 9, wherein the fluid contacts the thermally conductive surface to remove heat from the thermally conductive surface.

13. The cooling system of claim 9, wherein the cooling system includes an inlet connector connected to the inlet channel to receive the fluid.

14. The cooling system of claim 9, wherein the cooling system includes an outlet connector connected to the outlet channel to receive the fluid from the thermally conductive surface.

15. A method, comprising:

receiving, via a thermal member of a cooling device, heat from a heat block of an electronic device located adjacent to the thermal member;

transferring, via the thermal member and a thermally conductive surface located in a cooling channel, heat from the electronic device through the thermal member and to the thermally conductive surface, wherein transferring the heat from the electronic device to the thermal member of the cooling device includes transferring the heat between the electronic device and the thermal member via a dry disconnect between the electronic device and the cooling device, and wherein the dry disconnect allows the fluid to cool the electronic device without the fluid entering the electronic device;

transporting, via an inlet channel of a support member, a fluid to the cooling channel;

removing, via the fluid contacting the thermally conductive surface in the cooling channel, heat from the thermally conductive surface; and

transporting, via an outlet channel of the support member, the fluid from the cooling channel.

16. The method of claim 15, wherein the method includes receiving the heat from the heat block via a heat pipe.

17. The method of claim 16, wherein the method includes generating, by a component of the electronic device, the heat received by the heat block via the heat pipe, wherein the heat pipe thermally connects the component of the electronic device with the heat block.

18. The method of claim 15, wherein the method includes transporting the fluid from the outlet channel of the cooling device to a heat exchanger to remove heat from the fluid.

19. The method of claim 18, wherein the method includes transporting the fluid from the heat exchanger to the inlet channel for reuse in the cooling device.