Solid multilayer structure as semiproduct for meta-capacitor

• US 10,347,423 B2
• Filed: 10/12/2017
• Issued: 07/09/2019
• Est. Priority Date: 05/12/2014
• Status: Active Grant

• Current Assignee: Capacitor Sciences Incorporated (Bolloré SE)
• Original Assignee: Capacitor Sciences Incorporated (Bolloré SE)
• Inventors: Lazarev, Pavel Ivan
• Primary Examiner(s): Ferguson, Dion
• Application Number:
  US15/782,752
• Publication Number:
  US 20180114641A1
• Time in Patent Office: 635 Days
• CPC Class Codes: H01G 4/08 Inorganic dielectrics
• CPC Class Codes: H01G 4/14 Organic dielectrics
• CPC Class Codes: H01G 4/18 of synthetic material, e.g. derivatives of cellulose H01G4/16 takes precedence
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/32 Wound capacitors

Abstract

The present disclosure provides solid multilayer structure having m polarization layers, and m+1 insulating layers disposed in a repeating sequence with the polarization layers, At least one polarization layer is comprised of materials selected from non-linear polarizable composite compounds and side chain polymers with non-linear polarizable pendants, and m is a number greater than or equal to 1. The insulating layer has a breakdown voltage greater than or equal to 0.01 volts (V) per nanometer (nm), and the polarization layer has a dielectric permittivity greater than or equal to 100. The solid multilayer structure may be used as a dielectric layer between two electrodes in capacitor.

Claims

1. A solid multilayer structure comprising a plurality of m polarization layers, and a plurality of m+1 insulating layers disposed in a repeating sequence with the plurality of the polarization layers,

wherein at least one polarization layer comprised of materials selected from non-linear polarizable composite compounds and side chain polymers with non-linear polarizable pendants, and m is a number greater than or equal to 1,

wherein the insulating layer has a breakdown voltage greater than or equal to 0.01 volts (V) per nanometer (nm), and the polarization layer has a dielectric permittivity greater than or equal to 100.

2. The solid multilayer structure of claim 1, wherein resistivity is between about 10¹⁵ Ohm cm and 10²² Ohm cm.

3. The solid multilayer structure of claim 1, wherein the insulating layers may be fabricated from a material selected from crystalline material, poly-crystal material, semi-crystalline, aligned supramolecular structures, and amorphous material.

4. The solid multilayer structure of claim 1, wherein the insulating layers is characterized by a band gap of greater than 4 eV and by breakdown field strength of greater than about 0.001 volts (V)/nanometer (nm), 0.01 V/nm, 0.05 V/nm, 0.1 V/nm, 0.2 V/nm, 0.3 V/nm, 0.4 V/nm, 0.5 V/nm, or 1 V/nm.

5. The solid multilayer structure of claim 1, wherein at least one of the insulating layers A comprises a modified organic compounds of the general structural formula I:

{Cor}(M)_k, 

 

(I)

where Cor is a polycyclic organic compound, each M is independently a modifying functional group; and

k is an integer of the modifying functional groups that is greater than or equal to zero, and wherein the polycyclic organic compound is selected from the group consisting of rylene fragments, chromophores, oligophenyl, imidazole, pyrazole, acenaphthene, triaizine, indanthrone and structures 1-44 and their derivative structures;

6. The solid multilayer structure of claim 5, wherein at least one of the insulating layers comprises a material selected from oxides (may be selected from SiO₂, HfO₂, Al₂O₃), nitrides (may be Si₃N₄), oxynitrides and fluorides.

7. The solid multilayer structure of claim 1, wherein at least one of the insulating layers comprises a material formed on the basis of polymers soluble in organic solvents and having a structure selected from the structures 51 to 56:

8. The solid multilayer structure of claim 1, wherein at least one of the polarization layers may be fabricated from a material selected from crystalline material, poly-crystal material, and amorphous material and its material possesses dielectric permittivity ε

_pol which may be in the broad range at least about 100, 200, 300, 400, 500, 1000, 2000, 3000, 4000, 5000, 6000, 7000, 8000, 9000, 10,000, or 100,000.

9. The solid multilayer structure of claim 1, wherein the thickness of the insulating layer (d_ins) and thickness of the polarization layer (d_pol) and breakdown field strength of the insulating layers E_ins and breakdown field strength of the polarization layers E_pol satisfy the following relations:

d_ins<

d_pol, and E_ins>

E_pol.

10. The solid multilayer structure of claim 1, wherein the parameter m is greater than or equal to 1, a dielectric material of the insulating layers is polyethylene, a material of the polarization layer is a micro-dispersion PANI-DBSA/PAA, the ratio of PANI to PAA in the composite is greater than or equal to about 20 wt %, a thickness of the insulating layer d_pol is from 2.5 nm to 1000 nm, and a thickness of the polarization layer (d_pol) is from 10 micrometer (μ

m) to 1.0 mm.

11. The solid multilayer structure of claim 1, wherein the parameter m is greater than or equal to 1, a dielectric material of the insulating layers is polyethylene, a thickness of the insulating layer (d_ins) is from 2.5 nm to 1000 nm, and a thickness of the polarization layer (d_cond) is from 10 micrometer (μ

m) to 50 μ

m.

12. The solid multilayer structure of claim 1, wherein said polarization layers comprise a surfactant selected from:

dodecylbenzenesulfonate (DBSA), polyoxyethylene glycol alkyl ethers, polyoxypropylene glycol alkyl ethers, polyoxyethylene glycol octylphenol ethers, polyoxyethylene glycol sorbitan alkyl esters, sorbitan alkyl esters, and dobecyldimethylamine oxide.

13. The solid multilayer structure of claim 1, further comprising additional protective layers located upon and/or under the solid multilayer structure, wherein the additional protective layers protect the plurality of insulating and polarization layers from damage, aid in co-extrusion processing and/or to enhance mechanical properties at post-processing.

14. The solid multilayer structure of claim 13, wherein the additional protective layers comprise polymers such as polyesters including carboxylate and glycol monomer molecules, wherein the carboxylate monomer molecules comprise 2,6-naphthalene dicarboxylic acid and isomers thereof, terephthalic acid;

isophthalic acid;

phthalic acid;

azelaic acid;

adipic acid;

sebacic acid;

norbornene dicarboxylic acid;

bi-cyclo-octane dicarboxylic acid;

1,4-cyclohexane dicarboxylic acid and isomers thereof, t-butyl isophthalic acid, trimellitic acid, sodium sulfonated isophthalic acid;

4,4′

-biphenyl dicarboxylic acid and isomers thereof, and lower alkyl esters of these acids, such as methyl or ethyl esters where the term “

lower alkyl”

refers to C1-C10 straight-chained or branched alkyl groups, and wherein the glycol monomer molecules comprise ethylene glycol;

propylene glycol;

1,4-butanediol and isomers thereof, 1,6-hexanediol;

neopentyl glycol;

polyethylene glycol;

diethylene glycol;

tricyclodecanediol;

1,4-cyclohexanedimethanol and isomers thereof;

norbornanediol;

bicyclo-octanediol;

trimethylol propane;

pentaerythritol;

1,4-benzenedimethanol and isomers thereof, bisphenol A;

1,8-dihydroxy biphenyl and isomers thereof, and 1,3-bis (2-hydroxyethoxy)benzene.

15. The solid multilayer structure of claim 13, further comprising binding (tie) layers which may be present between the additional protective layers and the insulating layers and polarization and/or between the insulating layers and polarization.

16. The solid multilayer structure of claim 15, wherein the binding (tie) layers comprise polydimethyl siloxane oxamide based segmented copolymer (SPDX), and copolymers of polyethylene terephthalates (CoPETs) including modifications with functional groups such as sulfonic acids, poly (methyl methacrylate)/ poly(vinylidene fluoride (PMMA/PVDF) blends, modified olefins with functional co-monomers such as maleic anhydride, acrylic acid, methacrylic acid or vinyl acetate, UV or thermally curable acrylates, silicones, epoxies, siloxanes, and urethane acrylates, conventional plasticizers, tackifiers, or combinations thereof.

17. The solid multilayer structure of claim 1, further comprising hard layers which are located inside and outside the multilayer structure and provide its impact-resistance and prevent interlayer abrasion of the multilayered structure.

18. The solid multilayer structure of claim 17, wherein the hard layers comprise PMMA/PVDF blends, thermoplastic polyurethanes, curable polyurethanes, CoPET, cyclic olefin copolymers (COC'"'"'s), fluoropolymers and their copolymers such as poly(vinylidene fluoride) (PVDF), ETFE, FEP, and THV, thermoplastic and curable acrylates, cross-linked acrylates, cross-linked urethane acrylates, cross-linked urethanes, curable or cross-linked polyepoxides, and SPDX.

19. The solid multilayer structure of claim 1, wherein at least one insulating layer and one polarization layer are covalently bonded, and wherein the insulating layers are comprised of carbon chain moieties longer than four carbons, and wherein the polarization layers are comprised of electrically polarizable moieties.

20. The solid multilayer structure of claim 1, wherein at least one insulating layer is comprised of two sets of carbon chain moieties longer than 4 carbons which are intercalated, and wherein one set of carbon chain moieties is covalently bonded to a first polarization layer and another set of carbon chain moieties is covalently bonded to a second polarization layer, and wherein the polarization layers are covalently bonded to sequential insulating layers, and wherein the polarization layers are comprised of electrically polarizable moieties.

21. The solid multilayer structure of claim 1, wherein the insulating layer includes at least one composite polymeric materials of the following general formula:

22. A capacitor comprising:

a first electrode;

a second electrode, and a dielectric layer of molecular material disposed between said first and second electrodes, wherein the dielectric layer includes the solid multilayer structure of claim 1.