Fingerprint identification module and method for manufacturing the same

• US 10,350,869 B2
• Filed: 08/11/2017
• Issued: 07/16/2019
• Est. Priority Date: 07/15/2016
• Status: Active Grant

• Current Assignee: Shenzhen Goodix Technology Co., Ltd.
• Original Assignee: Shenzhen Goodix Technology Co., Ltd.
• Inventors: Wu, Baoquan, Long, Wei
• Primary Examiner(s): Werner, Brian
• Application Number:
  US15/674,724
• Publication Number:
  US 20180015711A1
• Time in Patent Office: 704 Days
• CPC Class Codes: B32B 2305/72 Cured, e.g. vulcanised, cross-linked
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 37/003 to avoid air inclusion
• CPC Class Codes: B32B 37/06 characterised by the heating method
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: B32B 37/1284 Application of adhesive
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/92 Specific sequence of method steps
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.

Claims

1. A fingerprint identification module, wherein the fingerprint identification module is obtained by dicing a board-level module, comprising:

a fingerprint identification chip, a filling material, a color coating and a cover;

wherein the color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment;

wherein the fingerprint identification chip comprises an identification area, an interconnection gold thread, a molding layer, a substrate layer and a pad;

wherein the identification area is disposed inside of the molding layer, the substrate layer is adhered to the molding layer, the pad is disposed on an upper surface and a lower surface of the substrate layer and is further disposed on an upper surface of the identification area, and the pad on the upper surface of the identification area is connected to the pad on the upper surface of the substrate layer via the interconnection gold thread.

2. The fingerprint identification module according to claim 1, wherein an upper surface of the inversely-attached fingerprint identification chip is above an upper surface of the filling material.

3. The fingerprint identification module according to claim 1, wherein the filling material is an organic colloid, a film or a plastic, and has a photo-induced effect;

and

the hollow area is obtained by exposing and developing a part of the filling material.

4. The fingerprint identification module according to claim 1, wherein the cover is a strip-type glass, a strip-type ceramic, a substrate-type glass, a substrate-type ceramic, or a disc-type glass having the same shape as a wafer.

5. A method for manufacturing a fingerprint identification module, wherein the method comprises:

manufacturing at least one fingerprint identification chip;

wherein the fingerprint identification chip comprises an identification area, an interconnection gold thread, a molding layer, a substrate layer and a pad; and

wherein the identification area is disposed inside of the molding layer, the substrate layer is adhered to the molding layer, the pad is disposed on an upper surface and a lower surface of the substrate layer and is further disposed on an upper surface of the identification area, and the pad on the upper surface of the identification area is connected to the pad on the upper surface of the substrate layer via the interconnection gold thread;

manufacturing a board-level module comprising a filling material, a color coating and a cover, and processing an array of hollow areas in a predetermined quantity on the filling material of the board-level module;

attaching a fingerprint identification chip into each hollow area in the array of hollow areas of the filling material in a vacuum environment; and

dicing the board-level module to obtain fingerprint identification modules.

6. The method according to claim 5, wherein the attaching a fingerprint identification chip into each hollow area in the array of hollow areas of the filling material comprises:

uniformly filling a glue with a preset thickness at a bottom of each of the hollow areas, and performing a defoaming process to the glue;

inversely placing the fingerprint identification chip in each hollow area in the array of hollow areas of the filling material; and

pressurizing the fingerprint identification chip and heating to cure the fingerprint identification chip, such that the fingerprint identification chip is tightly attached to the glue and the glue is solidified.

7. The method according to claim 6, wherein an upper surface of the inversely-placed fingerprint identification chip is above an upper surface of the filling material.

8. The method according to claim 5, wherein the filling material is an organic colloid, a film or a plastic, and has a photo-induced effect;

and

each hollow area in the array of hollow areas of the filling material is obtained by exposing and developing the filling material.

9. The method according to claim 5, wherein the cover is a strip-type glass, a strip-type ceramic, a substrate-type glass, a substrate-type ceramic, or a disc-type glass having the same shape as a wafer.