Method for obtaining a nano capsule structure
First Claim
1. A method for obtaining at least one nano-capsule structure, wherein at least one capsule encapsulates a compound, said method comprising the following steps:
- depositing at least one layer of resin having a thickness between 300 nm and 2 microns on a layer of substrate;
structuring said layer of resin by one of a group consisting of;
low-voltage electron lithography, optical lithography and nanoimprinting;
forming at least one cavity in said thickness of said layer of resin, the cavity having a depth of 20-450 nm;
sputtering an encapsulating material under vacuum so as to form an isotropic deposition of at least one layer of said encapsulating material;
sealing the cavity with a sealing material so as to form at least one capsule; and
dissolving said layer of resin by soaking into a suitable solvent.
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Accused Products
Abstract
The method for obtaining a nano-capsule structure includes at least one layer of resin deposited on a layer of substrate. The capsule nanometric in size is capable of enabling the encapsulation of a compound. The layer of resin is structured, by low voltage electron lithography, or by optical lithography or by nanoimprinting in such a way as to obtain at least one cavity in the thickness of the layer of resin. The cavity has a depth smaller than the thickness of the layer of resin. At least one layer of an encapsulating material is isotropically deposited by sputtering the material under vacuum. The cavity is sealed with a sealing material. The layer of resin is dissolved by soaking in a suitable solvent.
4 Citations
16 Claims
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1. A method for obtaining at least one nano-capsule structure, wherein at least one capsule encapsulates a compound, said method comprising the following steps:
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depositing at least one layer of resin having a thickness between 300 nm and 2 microns on a layer of substrate; structuring said layer of resin by one of a group consisting of;
low-voltage electron lithography, optical lithography and nanoimprinting;forming at least one cavity in said thickness of said layer of resin, the cavity having a depth of 20-450 nm; sputtering an encapsulating material under vacuum so as to form an isotropic deposition of at least one layer of said encapsulating material; sealing the cavity with a sealing material so as to form at least one capsule; and dissolving said layer of resin by soaking into a suitable solvent. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification