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High performance interconnect link layer

  • US 10,365,965 B2
  • Filed: 09/15/2017
  • Issued: 07/30/2019
  • Est. Priority Date: 10/22/2012
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a host processor comprising;

    physical layer logic; and

    link layer logic, comprising circuitry to;

    generate a flit comprising a plurality of slots, wherein one or more of the slots is encoded with a return credit response, at least one other one of the plurality of slots is encoded as a null slot, the flit is according to a format to enable a plurality of transaction headers to be contained in the flit, and the flit comprises a piece of a larger network packet; and

    a transmitter to send the flit on a link to another device.

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