Housing to retain integrated circuit package

• US 10,383,240 B2
• Filed: 06/13/2017
• Issued: 08/13/2019
• Est. Priority Date: 06/13/2017
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Hunter, J. L., Bussan, Anthony J.
• Primary Examiner(s): Bui, Hung S.
• Application Number:
  US15/621,545
• Publication Number:
  US 20180359871A1
• Time in Patent Office: 791 Days
• Field of Search: 361820
• CPC Class Codes: G01R 33/091 Constructional adaptation of the sensor to specific applications
• CPC Class Codes: G01R 33/093 using multilayer structures, e.g. giant magnetoresistance sensors thin magnetic films H01F10/00
• CPC Class Codes: G01R 33/096 anisotropic magnetoresistance sensors
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03

Abstract

Embodiments relate generally to systems and methods for retaining a sensor package within a carrier. A sensor package assembly may comprise a sensor package comprising at least one sensor element located within a sensing face of the sensor package; and a carrier comprising retention features configured to retain the sensor package while completely exposing the sensing face of the sensor package. A method for retaining a sensor package within a carrier may comprise inserting a sensor package into a carrier, wherein inserting the sensor package displaces one or more retaining clips of the carrier; retaining the sensor package within the carrier via the retaining clips interfacing with one or more notches of the sensor package; and exposing a sensing face of the sensor package via an opening in the carrier, wherein the sensor package comprises one or more sensor elements located in the sensing face of the sensor package.

Claims

1. A sensor package assembly comprising:

a sensor package comprising at least one sensor element for sensing a property of an object that is external to a sensing face of the sensor package, the sensor package comprising a housing that is configured to house the at least one sensor element as wells as at least one other integrated circuit element;

a carrier comprising one or more retention features that are configured to retain the sensor package relative to the carrier while completely exposing the sensing face of the sensor package, wherein the one or more retention features comprise one or more flexible arms; and

wherein the housing comprises one or more notches, wherein each of the one or more flexible arms of the carrier are configured to snap into a corresponding one of the one or more notches to help retain the housing of the sensor package relative to the carrier.

2. The sensor package assembly of claim 1, wherein the carrier is further configured to at least partially expose one or more leads of the sensor package.

3. The sensor package assembly of claim 1, wherein the one or more flexible arms comprises a flexible material.

4. The sensor package of claim 1 wherein the housing comprises at least one angled surface, and wherein the carrier comprises at least one angled surface configured to fit against the at least one angled surface of the housing.

5. The sensor package assembly of claim 1, wherein the sensor element comprises an anisotropic magneto resistance (AMR) sensor.

6. The sensor package assembly of claim 1, wherein the object that is external to the sensing face comprises a magnet ring, and wherein the sensor element is configured to detect movement of the magnet ring.

7. The sensor package assembly of claim 1, wherein the sensor package comprises a plurality of sensor elements, and wherein the plurality of sensor elements are located at or near the sensing face.

8. A method for retaining a sensor package within a carrier, the method comprising:

inserting a sensor package into a carrier, wherein inserting the sensor package displaces one or more retaining clips of the carrier;

retaining the sensor package within the carrier via the retaining clips interfacing with one or more notches of the sensor package, wherein the retaining clips comprise flexible arms configured to snap into the one or more notches of the sensor package; and

exposing a sensing face of the sensor package via an opening in the carrier, wherein the sensor package comprises one or more sensor elements adjacent the sensing face of the sensor package for sensing a property of an object that is external to the sensing face of the sensor package.

9. The method of claim 8, further comprising sensing, via the one or more sensor elements, movement of a magnet ring.

10. The method of claim 9, further comprising determining a speed of an object associated with the magnet ring based on the sensed movement of the ring.

11. The method of claim 8, wherein inserting the sensor package into the carrier comprises aligning one or more angled surfaces of the sensor package with one or more angled surfaces of the carrier.

12. The method of claim 8, further comprising at least partially exposing one or more leads extending from a housing of the sensor package.

13. The method of claim 8, wherein the sensor package comprises an anisotropic magneto resistance (AMR) sensor.

14. A carrier configured to retain a sensor package, wherein the sensor package includes at least one sensor element located near a sensing face of the sensor package for sensing a property of an object that is external to the sensing face of the sensor package, the sensor package including one or more notches, the carrier comprising:

a plurality of walls forming a first opening configured expose the sensing face of the sensor package; and

one or more retaining clips configured to snap into corresponding notches in the housing of the sensor package to help retain the sensor package to the carrier.

15. The carrier of claim 14, further comprising one or more retaining walls shaped and configured to interface with the housing of the sensor package.

16. The carrier of claim 14, further comprising a plurality of walls forming a second opening configured to at least partially expose one or more leads extended from the housing of the sensor package.

17. The carrier of claim 14, wherein the housing of the sensor package comprises at least one angled surface, and wherein the carrier further comprises at least one angled surface configured to fit against the at least one angled surface of the housing.