Planar low-loss electromagnetic resonator

• US 10,389,181 B1
• Filed: 11/17/2016
• Issued: 08/20/2019
• Est. Priority Date: 11/17/2016
• Status: Active Grant

• Current Assignee: X Development LLC (Alphabet Inc.)
• Original Assignee: X Development LLC (Alphabet Inc.)
• Inventors: Grundmann, Michael, Levine, Gabriella
• Primary Examiner(s): Sun, Pinping
• Application Number:
  US15/354,482
• Time in Patent Office: 1,006 Days
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction
• CPC Class Codes: H04B 5/26 using coils

Abstract

The present disclosure relates to electromagnetic resonator antennas and methods for their manufacture. An example electromagnetic resonator antenna includes a first substrate and a first metal layer disposed on the first substrate. The first metal layer includes copper. The antenna also includes a dielectric layer disposed on the first metal layer. The dielectric layer includes a polarizable electrical insulator. The antenna additionally includes a second metal layer disposed on the dielectric layer. The second metal layer includes copper. The antenna yet further includes a second substrate disposed on the second metal layer and a feed line electrically coupled to at least one of the first metal layer or the second metal layer. At least one aspect of at least one of the first metal layer, the dielectric layer, or the second metal layer is selected based on a desired resonance frequency.

Claims

1. A device comprising:

a first substrate;

a first metal layer disposed on the first substrate along a first plane, wherein the first metal layer comprises copper, wherein the first metal layer has a spiral or loop shape along the first plane;

a dielectric layer disposed on the first metal layer, wherein the dielectric layer comprises a polarizable electrical insulator;

a second metal layer disposed on the dielectric layer along a second plane that is substantially parallel to the first plane, wherein the second metal layer comprises copper, wherein the second metal layer has a spiral or loop shape along the second plane;

a second substrate disposed on the second metal layer; and

a feed line electrically coupled to at least one of the first metal layer or the second metal layer, wherein at least one aspect of at least one of;

the first metal layer, the dielectric layer, or the second metal layer is selected based on a desired resonance frequency, wherein the first substrate, the dielectric layer and the second substrate are attached to one another by way of a plurality of mechanical attachment devices.

2. The device of claim 1, wherein a material of the dielectric layer comprises cross-linked polystyrene, polyether ether ketone, or ultra-high-molecular-weight polyethylene.

3. The device of claim 1, wherein a material of the dielectric layer comprises polytetrafluoroethylene (PTFE).

4. The device of claim 1, wherein the first substrate and the second substrate comprise respective printed circuit boards comprising woven fiberglass cloth with an epoxy resin binder.

5. The device of claim 1, wherein the spiral or loop shape of the second metal layer substantially mirrors and spatially overlays the spiral or loop shape of the first metal layer, and wherein the first and second metal layers are separated by the dielectric layer, thereby causing the first and second metal layers to define both capacitance and inductance.

6. The device of claim 1, wherein the plurality of mechanical attachment devices comprises at least one of a fastener, a mechanical bracket, or a clamp.

7. The device of claim 1, wherein at least the first metal layer, the dielectric layer, and the second metal layer aligned to one another based on at least one of:

an alignment pin, a fiducial mark, or a mechanical bracket.

8. The device of claim 1, wherein the at least one aspect of the first metal layer, the dielectric layer, or the second metal layer is selected based further on at least one of a desired capacitance value or a desired inductance value.

9. The device of claim 1, wherein the device has a resonance frequency of 13.56 MHz.

10. The device of claim 1, wherein the device has a quality factor Q greater than 300.

11. A method of manufacturing an antenna, comprising:

forming a first metal layer on a first substrate along a first plane, wherein the first metal layer is formed in a spiral or loop shape along the first plane;

forming a second metal layer on a second substrate along a second plane, wherein the second metal layer is formed in a spiral or loop shape along the second plane, and wherein the first metal layer and the second metal layer comprise copper;

providing a dielectric layer between the first substrate and the second substrate, wherein the first metal layer and the second metal layer are disposed on the dielectric layer, wherein the dielectric layer comprises a polarizable electrical insulator, wherein at least one aspect of at least one of;

the first metal layer, the dielectric layer, or the second metal layer is selected based on a desired resonance frequency; and

coupling the first substrate, the dielectric layer, and the second substrate by way of a plurality of mechanical attachment devices, the coupling causing the second plane to be substantially parallel to the first plane.

12. The method of claim 11, further comprising:

electrically coupling a feed line to at least one of the first metal layer or the second metal layer.

13. The method of claim 11, wherein a material of the dielectric layer comprises cross-linked polystyrene, polyether ether ketone, or ultra-high-molecular-weight polyethylene.

14. The method of claim 11, wherein a material of the dielectric layer comprises polytetrafluoroethylene (PTFE).

15. The method of claim 11, wherein the first substrate and the second substrate comprise respective printed circuit boards comprising woven fiberglass cloth with an epoxy resin binder.

16. The method of claim 11, where the coupling further causes the spiral or loop shape of the second metal layer to substantially mirror and spatially overlay the spiral or loop shape of the first metal layer, and where the providing of the dielectric layer results in the first and second metal layers being separated by the dielectric layer, thereby causing the first and second metal layers to define both capacitance and inductance.

17. The method of claim 11, further comprising selecting the at least one aspect of the first metal layer, the dielectric layer, or the second metal layer based further on at least one of a desired capacitance value or a desired inductance value.

18. The method of claim 11, wherein the plurality of mechanical attachment devices comprises at least one of a fastener, a mechanical bracket, or a clamp.

19. The method of claim 11, further comprising aligning at least the first metal layer, the dielectric layer, and the second metal layer to one another based on at least one of:

an alignment pin, a fiducial mark, or a mechanical bracket.

20. The method of claim 11, wherein the antenna has a resonance frequency of 13.56 MHz and a quality factor Q greater than 300.