Electronic device, electronic apparatus, and moving object

• US 10,393,524 B2
• Filed: 10/19/2015
• Issued: 08/27/2019
• Est. Priority Date: 10/28/2014
• Status: Active Grant

• Current Assignee: Columbia Peak Ventures, LLC (Dominion Harbor Enterprises, LLC)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Shimura, Masashi, Nomiya, Takashi
• Primary Examiner(s): West, Paul M.
• Assistant Examiner(s): Shabman, Mark A
• Application Number:
  US14/886,630
• Publication Number:
  US 20160116284A1
• Time in Patent Office: 1,408 Days
• CPC Class Codes: G01C 19/5628 Manufacturing; Trimming; Mounting; Housings
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

An electronic device includes an vibration element including an vibration body provided with an adjustment section, an electrode disposed on the vibration body, and a connection electrode electrically connected to the electrode, an IC so disposed that the IC faces the vibration element, terminals disposed on the side facing the upper surface of the IC and electrically connected to the connection electrode via a fixing member, wiring sections electrically connected to the terminals and located below the terminals, and a protective layer located above the wiring sections and disposed in a portion where the adjustment section overlaps with the wiring sections in a plan view.

Claims

1. An electronic device comprising:

an integrated circuit (IC);

a vibration element including;

a vibration body provided with an adjustment section;

an electrode disposed on the vibration body; and

a connection electrode electrically connected to the electrode and connected to the IC via an electrically conductive connection member; and

a plurality of layers disposed on an upper surface of the IC, the plurality of layers including;

a connection pad electrically connected to the connection electrode via the electrically conductive connection member;

a wiring line electrically connected to the connection pad and located between the connection pad and the IC; and

a first protective layer located between the wiring line and the vibration element and disposed at a position where the adjustment section overlaps with the wiring line in a plan view.

2. The electronic device according to claim 1, wherein:

the plurality of layers includes a second protective layer, the second protective layer being disposed between the first protective layer and the vibration element and overlapping the entire vibration element in the plan view.

3. The electronic device according to claim 2, wherein:

the plurality of layers includes;

a first insulating layer; and

a second insulating layer disposed between the first insulating layer and the vibration element; and

the second protective layer is positioned between the second insulating layer and the vibration element.

4. The electronic device according to claim 3, wherein each of the first insulating layer and the second insulating layer has elasticity.

5. The electronic device according to claim 3, wherein:

the vibration body has a detection vibration arm; and

the electrode has a detection signal electrode disposed on the detection vibration arm.

6. The electronic device according to claim 3, wherein the vibration element is configured to detect angular velocity.

7. The electronic device according to claim 2, wherein the second protective layer contains a metal material.

8. The electronic device according to claim 2, wherein:

the vibration body has a detection vibration arm; and

the electrode has a detection signal electrode disposed on the detection vibration arm.

9. The electronic device according to claim 2, wherein the vibration element is configured to detect angular velocity.

10. An electronic apparatus comprising:

the electronic device according to claim 2; and

a display section.

11. A moving object comprising:

the electronic device according to claim 2; and

an attitude control device to which a detection signal of the electronic device is supplied.

12. The electronic device according to claim 1, wherein:

the plurality of layers includes;

a first insulating layer; and

a second insulating layer disposed between the first insulating layer and the vibration element;

the wiring line is disposed between the first and second insulating layers; and

the first insulating layer is disposed between the wiring line and the second insulating layer.

13. The electronic device according to claim 12, wherein each of the first insulating layer and the second insulating layer has elasticity.

14. The electronic device according to claim 12, wherein:

the vibration body has a detection vibration arm; and

the electrode has a detection signal electrode disposed on the detection vibration arm.

15. The electronic device according to claim 12, wherein the vibration element is configured to detect angular velocity.

16. The electronic device according to claim 1, wherein the first protective layer contains a metal material.

17. The electronic device according to claim 1, wherein:

the vibration body has a detection vibration arm; and

the electrode has a detection signal electrode disposed on the detection vibration arm.

18. The electronic device according to claim 1, wherein the vibration element is configured to detect angular velocity.

19. An electronic apparatus comprising:

the electronic device according to claim 1; and

a display section.

20. A moving object comprising:

the electronic device according to claim 1; and

an attitude control device to which a detection signal of the electronic device is supplied.

21. The electronic device according to claim 1, wherein the plurality of layers includes:

a first insulating layer disposed directly on the upper surface of the IC;

the wiring line disposed directly on the first insulating layer;

a second insulating layer disposed directly on both the first insulating layer and the wiring line; and

the connection pad disposed directly on the second insulating layer.