Substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
First Claim
1. A substrate, comprising:
- a) a substrate surface extending to a perimeter having an end defining a substrate surface area and a substrate thickness oriented about perpendicular to the substrate surface;
b) a cut-out residing within the substrate surface, the cut-out comprising a cut-out perimeter defining a cut-out shape oriented parallel to the substrate surface, the cut-out extending through the substrate thickness; and
c) at least one slit having a slit length extending from a slit proximal end to a slit distal end, a slit width oriented perpendicular to the slit length, and a slit depth extending at least partially within the substrate thickness, wherein the slit proximal end extends from the cut-out perimeter, the slit distal end extending towards a substrate edge;
d) wherein the cut-out and the at least one slit define a cut-out pattern surface area, and wherein a substrate is configured according to the equation;
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Accused Products
Abstract
An electrically conductive material configured having at least one opening of various unlimited geometries extending through its thickness is provided. The opening is designed to modify eddy currents that form within the surface of the material from interaction with magnetic fields that allow for wireless energy transfer therethrough. The opening may be configured as a cut-out, a slit or combination thereof that extends through the thickness of the electrically conductive material. The electrically conductive material is configured with the cut-out and/or slit pattern positioned adjacent to an antenna configured to receive or transmit electrical energy wirelessly through near-field magnetic coupling (NFMC). A magnetic field shielding material, such as a ferrite, may also be positioned adjacent to the antenna. Such magnetic shielding materials may be used to strategically block eddy currents from electrical components and circuitry located within a device.
174 Citations
18 Claims
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1. A substrate, comprising:
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a) a substrate surface extending to a perimeter having an end defining a substrate surface area and a substrate thickness oriented about perpendicular to the substrate surface; b) a cut-out residing within the substrate surface, the cut-out comprising a cut-out perimeter defining a cut-out shape oriented parallel to the substrate surface, the cut-out extending through the substrate thickness; and c) at least one slit having a slit length extending from a slit proximal end to a slit distal end, a slit width oriented perpendicular to the slit length, and a slit depth extending at least partially within the substrate thickness, wherein the slit proximal end extends from the cut-out perimeter, the slit distal end extending towards a substrate edge; d) wherein the cut-out and the at least one slit define a cut-out pattern surface area, and wherein a substrate is configured according to the equation; - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification