Opto-electronic modules, in particular flash modules, and method for manufacturing the same

• US 10,431,571 B2
• Filed: 12/18/2012
• Issued: 10/01/2019
• Est. Priority Date: 12/22/2011
• Status: Active Grant

• Current Assignee: Ams Sensors Singapore Pte. Ltd. (Ams-Osram AG)
• Original Assignee: Ams Sensors Singapore Pte. Ltd. (Ams-Osram AG)
• Inventors: Rudmann, Hartmut, Rossi, Markus, Kromhof, Rene
• Primary Examiner(s): Epps, Georgia Y
• Assistant Examiner(s): Williams, Don
• Application Number:
  US14/367,352
• Publication Number:
  US 20140361200A1
• Time in Patent Office: 2,478 Days
• Field of Search: 2502081, 250205, 250221, 2502221, 250239, 345 32, 345 39, 345 42, 345 46, 345 48, 345 58, 345 63, 345 80- 84
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/1715 : Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements

Abstract

The opto-electronic module comprises a substrate member (P); at least one emission member (E1; E2) mounted on said substrate (P); at least one detecting member (D) mounted on said substrate (P); at least one optics member (O) comprising at least one passive optical component (L); at least one spacer member (S) arranged between said substrate member (P) and said optics member (O). The opto-electronic modules can be very small and can be produced in high quality in high volumes. In particular, at least two emission members (E1, E2), e.g., two LEDs, are provided, for emitting light of variable color. This can improve illumination of a scene.

Claims

1. An opto-electronic module comprising:

a substrate member;

at least two emission members mounted on said substrate member;

at least one detecting member mounted on said substrate member;

an optics member comprising a first lens and a second lens; and

a spacer member arranged between said substrate member and said optics member, the spacer member abutting a first side of the substrate member and a first side of the optics member, and establishing a well-defined distance between the substrate member and the optics member, wherein the first side of the substrate member faces the first side of the optics member;

wherein the first lens is assigned to a first of said at least two emission members and the second lens is assigned to a second of said at least two emission members, said first lens and said first emission member being arranged such that light emitted from said first emission member traverses predominantly said first lens, and said second lens and said second emission member being arranged such that light emitted from said second emission member traverses predominantly said second lens, wherein a light intensity distribution of light emitted by said first emission member through said first lens leaving the opto-electronic module is different from a light intensity distribution of light emitted by said second emission member through said second lens leaving the opto-electronic module.

2. The module of claim 1

wherein the at least two emission members are nominally different with respect to their respective specifications.

3. The module according to claim 2, wherein at least two of said emission members have spectrally different light emission characteristics.

4. The module according to claim 3, wherein a first one of the at least two emission members is structured and configured for emitting light comprising at least one of:

a higher portion of light of the blue spectral range than a second one of the at least two emission members;

or

a smaller portion of light of the yellow spectral range than a second one of the at least two emission members.

5. The module according to claim 3, wherein at least a first and a second of said at least two emission members have different spectral emission characteristics for creating or mimicing an emission of white light of varying color temperature by varying a relative emission intensity of these two emission members.

6. The module according to claim 3, wherein the first one of the emission members emits substantially white light of a lower color temperature than the second one.

7. The module according to claim 3, comprising three or four or five emission members, a portion of them or all of them emitting light of a different spectral composition.

8. The module according to claim 2, wherein said substrate member is a printed circuit board.

9. The module according to claim 2, wherein said at least one detecting member is color-sensitive.

10. The module according to claim 2, wherein the at least two emission members are flash light sources.

11. An appliance comprising a multitude of modules according to claim 2, the appliance further comprising a substrate wafer, an optics wafer, and a spacer wafer, wherein the substrate members for the multitude of modules are comprised in said substrate wafer, the optics members for the multitude of modules are comprised in said optics wafer, and the spacer members for the multitude of modules are comprised in said spacer wafer.

12. An electronic device comprising at least one opto-electronic module according to claim 2 and a processing unit operationally connected to said at least two emission members and to said at least one detecting member.

13. The electronic device according to claim 12, wherein said processing unit is structured and configured for receiving signals from said detecting member and for controlling said emission member in dependence of said signals.

14. The module according to claim 1, wherein the light intensity distribution is an angular light intensity distribution.

15. The module according to claim 1, wherein said optics member comprises at least one non-transparent portion, and transparent portions comprising, respectively, said first and second lenses.

16. The module according to claim 1, wherein said substrate member is a printed circuit board.

17. The module according to claim 1, wherein the at least two emission members are flash light sources.

18. An appliance comprising a multitude of modules according to claim 1, the appliance comprising a substrate wafer, an optics wafer, a spacer wafer, wherein the substrate members for the multitude of modules are comprised in said substrate wafer, the optics members for the multitude of modules are comprised in said optics wafer, and the spacer members for the multitude of modules are comprised in said spacer wafer.

19. An electronic device comprising at least one opto-electronic module according to claim 1 and a processing unit operationally connected to said at least two emission members and to said at least one detecting member.

20. The module according to claim 1 wherein a spatial or angular light intensity distribution of light emitted by said first emission member through said first lens leaving the opto-electronic module is different from a spatial or angular light intensity distribution of light emitted by said second emission member through said second lens leaving the opto-electronic module.