×

Electronic device having a sidewall configured to facilitate through-metal energy transfer via near field magnetic coupling

  • US 10,432,033 B2
  • Filed: 12/08/2017
  • Issued: 10/01/2019
  • Est. Priority Date: 12/09/2016
  • Status: Active Grant
First Claim
Patent Images

1. An electronic device comprising:

  • a) an electronic circuit;

    b) a sidewall having a surface extending to a perimeter with an end defining a sidewall surface area and having a sidewall thickness oriented about perpendicular to the sidewall surface;

    c) a cut-out having a cut-out perimeter defining a cut-out shape oriented parallel to the sidewall surface residing within the sidewall surface area, the cut-out extending through the sidewall thickness; and

    d) at least one slit having a slit length extending from a slit proximal end to a slit distal end, a slit width oriented perpendicular to the slit length, and a slit depth extending at least partially within the sidewall thickness, wherein the slit proximal end extends from the cut-out perimeter and the slit distal end extends towards a sidewall edge;

    e) wherein the cut-out and the at least one slit define a cut-out pattern surface area, andwherein a substrate is configured according to the equation;

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×