Peelable adhesive polymeric film

  • US 10,442,959 B2
  • Filed: 04/29/2016
  • Issued: 10/15/2019
  • Est. Priority Date: 05/01/2015
  • Status: Active Grant
First Claim
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1. A method for manufacturing an electronic device comprising:

  • (a) heating a laminate comprising (i) a polyester film substrate having a first surface and a second surface, (ii) an adhesive coating derived from an aqueous composition comprising an aliphatic polyurethane and (iii) a glass or silicon wafer substrate, wherein the adhesive coating is disposed between the polyester film substrate and the glass or silicon wafer substrate, to a temperature of at least 150°

    C. for a period of at least two minutes; and

    (b) peeling the polyester film substrate from the glass or silicon wafer substrate to leave the adhesive coating on the glass or silicon wafer substrate.

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