Thick film element having covering layer with high heat conductivity

• US 10,455,643 B2
• Filed: 03/26/2016
• Issued: 10/22/2019
• Est. Priority Date: 02/03/2016
• Status: Active Grant

• Current Assignee: Guangdong Flexwarm Advanced Materials & Technology Co., Ltd.
• Original Assignee: Guangdong Flexwarm Advanced Materials & Technology Co., Ltd.
• Inventors: Huang, Weicong
• Primary Examiner(s): Fuqua, Shawntina T
• Application Number:
  US15/534,487
• Publication Number:
  US 20180352609A1
• Time in Patent Office: 1,305 Days
• CPC Class Codes: F28F 3/04 the means being integral with the element
• CPC Class Codes: H05B 2203/01 Heaters comprising a particular structure with multiple layers
• CPC Class Codes: H05B 2203/013 Heaters using resistive films or coatings
• CPC Class Codes: H05B 3/02 Details
• CPC Class Codes: H05B 3/12 characterised by the composition or nature of the conductive material
• CPC Class Codes: H05B 3/22 non-flexible
• CPC Class Codes: H05B 3/34 flexible, e.g. heating nets or webs

Abstract

The present invention provides a thick film element having a covering layer with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is a heating materials, and the mode of heating is electrical heating. The covering layer, the thick film coating and the carrier are selected from a material that fulfills every of the following equations:

${\lambda }_{1}A\frac{T_1-T_0}{d_1}=a\times {\lambda }_{3}A\frac{T_3-T_0}{d_3},{\lambda }_{2}A\frac{T_2-T_0}{d_2}=b\times {\lambda }_{1}A\frac{T_1-T_0}{d_1},{\lambda }_{2}A\frac{T_2-T_0}{d_2}=c\times {\lambda }_{3}A\frac{T_3-T_0}{d_3};$
wherein 200≤a≤10⁴, 0<b≤1000, 0<c≤5×10⁵. The covering layer of the thick film element of the present invention has high heat conductivity, and is suitable for coating products with a single-sided heating covering layer. The present invention improves heat transfer efficiency and reduces heat loss when double-sided heating is not required.

Claims

1. A thick film element having a covering layer with high heat conductivity, comprising:

a carrier;

a thick film coating deposited on the carrier; and

a covering layer overlaid on the coating, wherein the thick film coating is a heating material, and a mode of heating is electrical heating, wherein the carrier, the thick film coating and the covering layer are selected from a material that fulfills every of following equations;

2. The thick film element according to claim 1, wherein the heat conductivity coefficient λ

₃ of the carrier is smaller than or equal to 3 W/m·

k, the heat conductivity coefficient λ

₁ of the covering layer is larger than or equal to 3 W/m·

k, and 200≤

a≤

10⁴, 10≤

b≤

1000, 10⁴≤

c≤

5×

10⁵.

3. The thick film element according to claim 2, wherein a region between the carrier and the covering layer without the thick film coating is bound by printing, coating, spraying or sintering, or gluing.

4. The thick film element according to claim 1, wherein the carrier and the thick film coating are bound by printing or sintering, and the thick film coating and the covering layer are bound by printing, sintering, or vacuum.

5. The thick film element according to claim 1, wherein the carrier comprises polyimides, organic insulating materials, inorganic insulating materials, ceramics, glass ceramics, quartz, stone materials, fabrics and fiber.

6. The thick film element according to claim 1, wherein the thick film coating is one or more of silver, platinum, palladium, palladium oxide, gold and rare earth materials.

7. The thick film element according to claim 1, wherein the covering layer is made from one or more of polyester, polyimide or polyetherimide (PEI), ceramics, silica gel, asbestos, micarex, fabric and fiber.

8. The thick film element according to claim 1, wherein an area of the thick film coating is smaller than or equal to an area of the covering layer or an area of the carrier.

9. An use of a thick film element for coating products having a single-sided heating covering layer, wherein the thick film element has a covering layer with high heat conductivity and comprises:

a carrier;

a thick film coating deposited on the carrier; and

a covering layer overlaid on the coating, wherein the thick film coating is a heating material, and a mode of heating is electrical heating, wherein the carrier, the thick film coating and the covering layer are selected from a material that fulfills every of following equations;

10. The use of the thick film element according to claim 9, wherein the heat conductivity coefficient λ

₃ of the carrier is smaller than or equal to 3 W/m·

k, the heat conductivity coefficient λ

₁ of the covering layer is larger than or equal to 3 W/m·

k, and 200≤

a≤

10⁴, 10≤

b≤

1000, 10⁴≤

c≤

5×

10⁵.

11. The use of the thick film element according to claim 10, wherein a region between the carrier and the covering layer without the thick film coating is bound by printing, coating, spraying or sintering, or gluing.

12. The use of the thick film element according to claim 9, wherein the carrier and the thick film coating are bound by printing or sintering, and the thick film coating and the covering layer are bound by printing, sintering, or vacuum.

13. The use of the thick film element according to claim 9, wherein the carrier comprises polyimides, organic insulating materials, inorganic insulating materials, ceramics, glass ceramics, quartz, stone materials, fabrics and fiber.

14. The use of the thick film element according to claim 9, wherein the thick film coating is one or more of silver, platinum, palladium, palladium oxide, gold and rare earth materials.

15. The use of the thick film element according to claim 9, wherein the covering layer is made from one or more of polyester, polyimide or polyetherimide (PEI), ceramics, silica gel, asbestos, micarex, fabric and fiber.

16. The use of the thick film element according to claim 9, wherein an area of the thick film coating is smaller than or equal to an area of the covering layer or an area of the carrier.