High performance two-phase cooling apparatus

  • US 10,458,719 B2
  • Filed: 01/19/2016
  • Issued: 10/29/2019
  • Est. Priority Date: 01/22/2015
  • Status: Active Grant
First Claim
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1. A thermal ground plane, comprising:

  • a metal substrate comprising a plurality of microstructures formed in the metal substrate, forming a wicking structure having the plurality of microstructures;

    a vapor cavity, in communication with the wicking structure and the plurality of microstructures;

    at least one intermediate substrate with a plurality of protrusions, wherein the plurality of protrusions are directly coupled to each other by at least one cross-member disposed internal to the vapor cavity on the opposite side of the at least one intermediate substrate relative to the metal substrate, and wherein the plurality of protrusions is shaped to increase the effective aspect ratio of the wicking structure by fitting into the plurality of microstructures of the wicking structure in at least one region of the wicking structure; and

    a fluid contained within the thermal ground plane for transporting thermal energy from at least one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid is driven by capillary forces in at least two orthogonal directions, along the microstructures and along the at least one cross member.

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