Liquid cooling
First Claim
Patent Images
1. A device to provide liquid cooling, the assembly comprising:
- a thermal member including an array of cooling pins extending from the thermal member;
a support member including;
an inlet channel to provide a fluid to the array of cooling pins; and
an outlet channel to receive the fluid from the array of cooling pins;
a gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween; and
a thermally actuated valve connected to the support member and extending into the cooling channel to control a flow of the fluid through the cooling channel.
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Accused Products
Abstract
An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
185 Citations
20 Claims
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1. A device to provide liquid cooling, the assembly comprising:
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a thermal member including an array of cooling pins extending from the thermal member; a support member including; an inlet channel to provide a fluid to the array of cooling pins; and an outlet channel to receive the fluid from the array of cooling pins; a gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween; and a thermally actuated valve connected to the support member and extending into the cooling channel to control a flow of the fluid through the cooling channel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A cooling system, comprising:
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a thermal member including an array of cooling pins extending from the thermal member; a support member including; an inlet channel to provide a fluid to the array of cooling pins; and an outlet channel to receive the fluid from the array of cooling pins; a gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal between the thermal member and the support member; and a thermally actuated valve connected to the support member and extending into the cooling channel to control a flow of the fluid through the cooling channel; wherein heat is transferred from an electronic device to the cooling pins located in the cooling channel and to the fluid of the cooling system to cool the electronic device. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method, comprising:
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receiving, via a thermal member of a cooling device, heat from an electronic device located adjacent to the thermal member; transferring, via the thermal member and an array of cooling pins extending from the thermal member, heat from the electronic device through the thermal member and to the cooling pins; transporting, via an inlet channel of a support member, a fluid through a thermally actuated valve to a cooling channel, wherein the support member and thermal member include a gasket therebetween to form the cooling channel with a fluid tight seal and wherein the cooling pins are located in the cooling channel; removing, via the fluid contacting the cooling pins in the cooling channel, heat from the cooling pins; and transporting, via an outlet channel of the support member, the fluid from the cooling channel. - View Dependent Claims (17, 18, 19, 20)
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Specification