Cover of a mobile device and mobile device including the same

• US 10,461,793 B2
• Filed: 12/08/2016
• Issued: 10/29/2019
• Est. Priority Date: 07/03/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Young-Ki, Roh, Hyoung-Hwan, Song, Il-Jong, Jang, Yo-Han, Lee, Byeong-Hoon
• Primary Examiner(s): Nguyen, Hoang V
• Assistant Examiner(s): Salih, Awat M
• Application Number:
  US15/372,811
• Publication Number:
  US 20170093455A1
• Time in Patent Office: 1,055 Days
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 13/10 Resonant slot antennas
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04M 1/7246 by connection of exchangeable housing parts
• CPC Class Codes: H04M 2250/04 including near field communication means, e.g. RFID

Abstract

A cover of a mobile device includes a metal structure disposed to cover one surface of the mobile device. The metal structure includes a metal material, and operates as an antenna for a wireless communication of the mobile device.

Claims

1. A mobile device comprising:

a wireless communication chip configured to perform a wireless communication;

a matching circuit coupled to the wireless communication chip; and

a cover including,

a plate configured to cover at least one surface of the mobile device, and including a slit and an opening,

two terminals directly on the plate, the two terminals directly connected to the matching circuit, and

an insulating pattern dividing the plate into an inner region and an outer region surrounding the inner region, the insulating pattern surrounding the inner region of the plate at which a signal path from one of the two terminals to the other of the two terminals is formed,

wherein the slit is located between the two terminals, and extends from the opening,

at least a portion of the cover is configured to operate as an antenna for the wireless communication of the mobile device, and

the matching circuit is configured to perform an impedance matching between the wireless communication chip and the antenna for the wireless communication.

2. The mobile device of claim 1, wherein

the insulating pattern further divides the outer region of the plate into a first portion and a second portion, the first portion being at a top portion of the plate, the second portion being at a bottom portion of the plate, and

the inner region of the plate includes the opening.

3. The mobile device of claim 2, wherein the at least a portion of the cover includes the inner region.

4. The mobile device of claim 2, wherein the slit extends from the opening toward to at least one of the first portion or the second portion.

5. The mobile device of claim 1, wherein the plate includes metal material.

6. The mobile device of claim 1, wherein the antenna operates for a near field communication (NFC).

7. The mobile device of claim 1, wherein the mobile device does not include a separate antenna for the wireless communication.

8. A mobile device comprising:

a wireless communication chip configured to perform a wireless communication;

a matching circuit coupled to the wireless communication chip;

a cover including a plate configured to cover at least one surface of the mobile device, and two terminals directly on the plate, the plate including an opening and a slit, the two terminals directly connected to the matching circuit; and

an insulating pattern dividing the plate into an inner region and an outer region surrounding the inner region, the insulating pattern surrounding the inner region of the plate at which a signal path from one of the two terminals to the other of the two terminals is formed,

wherein the insulating pattern further divides the outer region of the plate into a first portion and a second portion,

the slit is between the two terminals, and extends from the opening toward one of the inner region or the first portion of the outer region,

the inner region of the plate is configured to operate as an antenna for the wireless communication of the mobile device, and

the matching circuit is configured to perform an impedance matching between the wireless communication chip and the antenna for the wireless communication.

9. The mobile device of claim 8, wherein

the first portion is at a top portion of the plate,

the second portion is at a bottom portion of the plate.

10. The mobile device of claim 8, wherein the plate includes metal material.

11. The mobile device of claim 8, wherein the plate includes a capacitor at the slit.

12. The mobile device of claim 8, wherein the opening has a triangular shape, a rectangular shape, a polygonal shape, a circular shape, or an elliptical shape.

13. The mobile device of claim 8, wherein the mobile device does not include a separate antenna for the wireless communication.

14. A mobile device comprising:

a wireless communication chip configured to perform a wireless communication;

a matching circuit coupled to the wireless communication chip; and

a cover including,

a plate configured to cover at least one surface of the mobile device and including an opening and a slit,

two terminals directly on the plate, the two terminals directly connected to the matching circuit, and

an insulating pattern dividing the plate into an inner region and an outer region surrounding the inner region, the insulating pattern surrounding the inner region of the plate at which a signal path from one of the two terminals to the other of the two terminals is formed,

wherein the insulating pattern further divides the outer region of the plate into a first portion and a second portion, the first portion being at a top portion of the plate, the second portion being at a bottom portion of the plate,

the slit is between the two terminals, and extends from the opening,

the inner region of the plate is configured to operate as an antenna for the wireless communication, and

the wireless communication chip is configured to perform the wireless communication via the matching circuit and the cover.

15. The mobile device of claim 14, wherein the two terminals are coupled to a capacitor included in the matching circuit.

16. The mobile device of claim 14, wherein the mobile device does not include a separate antenna for the wireless communication.

17. The mobile device of claim 14, wherein the plate includes metal material.

18. The mobile device of claim 14, wherein the inner region surrounds the opening.