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Fingerprint identification system and electronic device

  • US 10,474,865 B2
  • Filed: 10/12/2017
  • Issued: 11/12/2019
  • Est. Priority Date: 09/27/2016
  • Status: Active Grant
First Claim
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1. A fingerprint identification system, comprising:

  • a plurality of first pixel circuits, a first pixel circuit in the plurality of first pixel circuits forming a contact capacitance with a finger;

    a first sensing circuit, coupled to the first pixel circuit, for sensing the contact capacitance and outputting a first output signal, wherein the first output signal contains a big signal component and a small signal component, and the small signal component correlates with a change amount of the contact capacitance, and the big signal component comprises a signal component influenced by parasitic capacitance, temperature and/or noise;

    at least one second pixel circuit;

    a second sensing circuit, coupled to a second pixel circuit of the at least one second pixel circuit, for outputting a second output signal, wherein the second output signal is equal to the big signal component; and

    a differential amplifying circuit, coupled to the first sensing circuit and the second sensing circuit, for amplifying a difference value between the first output signal and the second output signal to generate an amplifying output signal, wherein the amplifying output signal correlates with the small signal component;

    wherein the second pixel circuit comprises;

    a contact layer, coupled to a first driving circuit to receive a first drive signal, the contact layer receiving a contact of the finger;

    a first shield layer, disposed below the contact layer;

    a first metal layer, disposed below the first shield layer, and coupled to a second driving circuit to receive a second drive signal; and

    a second metal layer, disposed below the first metal layer;

    wherein the first shield layer and the second metal layer are coupled to the second driving circuit to receive a third drive signal; and

    wherein the first metal layer is coupled to the second sensing circuit.

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