Additive composition and positive polishing slurry composition including the same
First Claim
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1. An additive composition comprising:
- a cationic compound;
an organic acid;
a nonionic compound; and
a pH adjuster,wherein a ratio of the cationic compound to the organic acid in the additive composition is from 2;
1 to 3;
1, andwherein each of the cationic compound and the organic acid is present in an amount of 0.001 wt % to 5 wt % in the additive composition,wherein the cationic compound is at least one selected from the group consisting of poly[bis(2-chloroethyl) ether-alt-1,3-bis[3-(dimethylamino)propyl]urea], histidine, and serine,wherein the organic acid comprises at least one selected from the group consisting of lactic acid and glycolic acid,wherein the nonionic compound is a polyethylene glycol (PEG),wherein dishing of 200 {acute over (Å
)} or less occurs, after a wafer that includes an oxide film and either a nitride film or a polysilicon film and that has a line-and-space pattern with a line width of 100 μ
m and a pitch less than 100 μ
m is polished using a positive polishing slurry composition comprising the additive composition, andwherein dishing of 320 {acute over (Å
)} or less occurs, after a wafer that includes an oxide film and either a nitride film or a polysilicon film and that has a line-and-space pattern with a line width of 100 μ
m or greater and 1 mm or less and a pitch of 100 μ
m or greater and 1 mm or less is polished using a positive polishing slurry composition comprising the additive composition.
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Abstract
An additive composition and a positive polishing slurry composition including the additive composition are provided. The additive composition includes a cationic compound, an organic acid, a nonionic compound, and a pH adjuster.
12 Citations
9 Claims
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1. An additive composition comprising:
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a cationic compound; an organic acid; a nonionic compound; and a pH adjuster, wherein a ratio of the cationic compound to the organic acid in the additive composition is from 2;
1 to 3;
1, andwherein each of the cationic compound and the organic acid is present in an amount of 0.001 wt % to 5 wt % in the additive composition, wherein the cationic compound is at least one selected from the group consisting of poly[bis(2-chloroethyl) ether-alt-1,3-bis[3-(dimethylamino)propyl]urea], histidine, and serine, wherein the organic acid comprises at least one selected from the group consisting of lactic acid and glycolic acid, wherein the nonionic compound is a polyethylene glycol (PEG), wherein dishing of 200 {acute over (Å
)} or less occurs, after a wafer that includes an oxide film and either a nitride film or a polysilicon film and that has a line-and-space pattern with a line width of 100 μ
m and a pitch less than 100 μ
m is polished using a positive polishing slurry composition comprising the additive composition, andwherein dishing of 320 {acute over (Å
)} or less occurs, after a wafer that includes an oxide film and either a nitride film or a polysilicon film and that has a line-and-space pattern with a line width of 100 μ
m or greater and 1 mm or less and a pitch of 100 μ
m or greater and 1 mm or less is polished using a positive polishing slurry composition comprising the additive composition. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification