Cooking vessel with a thermal sensor

• US 10,499,759 B2
• Filed: 02/08/2017
• Issued: 12/10/2019
• Est. Priority Date: 02/11/2016
• Status: Active Grant

• Current Assignee: Meyer Intellectual Properties Limited
• Original Assignee: Meyer Intellectual Properties Limited
• Inventors: Cheng, Stanley Kin Sui, Jenkins, Jonathan A., Vengroff, Darren Erik
• Primary Examiner(s): Huls, Natalie
• Assistant Examiner(s): Soto, Janice M
• Application Number:
  US15/427,677
• Publication Number:
  US 20170231415A1
• Time in Patent Office: 1,035 Days
• CPC Class Codes: A47J 27/002 Construction of cooking-vessels; Methods or processes of manufacturing specially adapted for cooking-vessels
• CPC Class Codes: A47J 36/321 the electronic control being performed over a network, e.g. by means of a handheld device
• CPC Class Codes: A47J 45/061 Saucepan, frying-pan handles A47J45/07 takes precedence
• CPC Class Codes: A47J 45/068 Handles having indicating means, e.g. for temperature A47J45/07 takes precedence
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 13/00 Thermometers specially adapted for specific purposes
• CPC Class Codes: G01K 2207/08 with food recipients having temperature sensing capability
• CPC Class Codes: H05B 2213/06 Cook-top or cookware capable of communicating with each other
• CPC Class Codes: H05B 6/062 for cooking plates or the like

Abstract

According to one example, a cookware apparatus includes a vessel. The vessel includes a bottom, and a sidewall surrounding the bottom and extending upward from the bottom so as to form a fluid retaining interior region. The sidewall terminates at a rim. The vessel also includes a channel extending through a portion of the bottom and further extending upward into and through a portion of the sidewall. The channel has an opening positioned in an external surface of the sidewall. The cookware apparatus further includes a thermal sensor positioned within the channel. The thermal sensor extends through the portion of the bottom and further extends upward into and through the portion of the sidewall.

Claims

1. A method, comprising:

a. providing a preform, the preform having;

i. a first bottom with a first diameter; and

ii. a first upward extending sidewall surrounding the first bottom and extending upward from the first bottom so as to form a fluid retaining interior region of the preform, the first sidewall terminating at a first rim and having a first height;

b. forming a first channel in the first bottom, the first channel having an opening in an external surface of the first bottom;

c. drawing the preform into the shape of a vessel, the vessel having;

i. a second bottom with a second diameter that is smaller than the first diameter;

ii. a second upward extending sidewall surrounding the second bottom and extending upward from the second bottom so as to form a fluid retaining interior region of the vessel, the second sidewall terminating at a second rim and having a second height that is greater than the first height; and

iii. a second channel extending through a portion of the second bottom and further extending upward into and through a portion of the second sidewall, the second channel having an opening positioned in an external surface of the second sidewall;

d. positioning a thermal sensor within the second channel so that a thermal sensing device of the thermal sensor is positioned within the portion of the second bottom, and further so that one or more sensor leads of the thermal sensor extend from the portion of the second bottom upward into and through the portion of the second sidewall, and further so that the one or more sensor leads extend out of the opening in the external surface of the second sidewall;

e. routing the one or more sensor leads within a flange of a handle;

f. coupling the flange of the handle to the vessel, wherein the flange is coupled to the vessel in a position over the opening in the external surface of the second sidewall, wherein an electronic circuit is positioned on or in the handle; and

g. coupling the one or more sensor leads to the electronic circuit.

2. A method, comprising:

a. providing a preform, the preform having;

i. a first bottom with a first diameter;

ii. a first upward extending sidewall surrounding the first bottom and extending upward from the first bottom so as to form a fluid retaining interior region of the preform, the first sidewall terminating at a first rim and having a first height; and

iii. a first channel formed in the first bottom and having an opening in an external surface of the first bottom;

b. changing the preform into the shape of a vessel, the vessel having;

i. a second bottom with a second diameter that is smaller than the first diameter;

ii. a second upward extending sidewall surrounding the second bottom and extending upward from the second bottom so as to form a fluid retaining interior region of the vessel, the second sidewall terminating at a second rim and having second height that is greater than the first height; and

iii. a second channel extending through a portion of the second bottom and further extending upward into and through a portion of the second sidewall, the second channel having an opening positioned in an external surface of the second sidewall; and

c. positioning a thermal sensor within the second channel, the thermal sensor extending through the portion of the second bottom and further extending upward into and through the portion of the second sidewall.

3. The method of claim 2, further comprising forming the first channel in the first bottom of the preform.

4. The method of claim 2, further comprising forming the preform from a disk.

5. The method of claim 2, wherein changing the preform into the shape of the vessel comprises drawing the preform into the shape of the vessel.

6. The method of claim 2, further comprising:

a. coupling a handle to the vessel, the handle having an electronic circuit positioned on or in the handle; and

b. coupling a portion of the thermal sensor to the electronic circuit.

7. The method of claim 6, wherein coupling the handle to the vessel comprises coupling a flange of the handle to the vessel, wherein the flange is coupled to the vessel in a position over the opening in the external surface of the second sidewall.

8. The method of claim 2, wherein the thermal sensor comprises:

a. a thermal sensing device; and

b. one or more sensor leads communicatively coupled to the thermal sensing device.

9. The method of claim 8, further comprising:

a. coupling a handle to the vessel, the handle having an electronic circuit positioned on or in the handle; and

b. coupling the one or more sensor leads to the electronic circuit.

10. The method of claim 2, wherein the vessel is a pot, a pan, a skillet, a sauté

pan, a stock pot, or a chefs pan.