Optical module and manufacturing process thereof

• US 10,508,935 B2
• Filed: 10/15/2015
• Issued: 12/17/2019
• Est. Priority Date: 10/15/2015
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Chang, Yung-Yi, Chen, Ying-Chung
• Primary Examiner(s): Lee, John R
• Application Number:
  US14/884,065
• Publication Number:
  US 20170108357A1
• Time in Patent Office: 1,524 Days
• CPC Class Codes: G01D 5/34 the beams of light being detected by photocells

Abstract

The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.

Claims

1. An optical module, comprising:

a carrier;

a light source disposed adjacent to a surface of the carrier;

a light detector disposed adjacent to the surface of the carrier; and

a molding compound encapsulating the light source and the light detector, and including at least one sloped structure, the at least one sloped structure comprising a sloped surface extended between a side surface and a top surface of the molding compound; and

a lid disposed between the light source and the light detector, and surrounding the light source and the light detector.

2. The optical module of claim 1, wherein the light source and a portion of the molding compound surrounding the light source form an encapsulated light source, and wherein the encapsulated light source comprises a top surface and a side surface, and a roughness of the top surface of the encapsulated light source is different from a roughness of the side surface of the encapsulated light source.

3. The optical module of claim 2, wherein the side surface of the encapsulated light source is a cut side of the encapsulated light source.

4. The optical module of claim 1, wherein the light detector and a portion of the molding compound surrounding the light detector form an encapsulated light detector, wherein the encapsulated light detector comprises a top surface and a side surface, and a roughness of the top surface of the encapsulated light detector is different from a roughness of the side surface of the encapsulated light detector;

and wherein the at least one sloped structure is disposed between the top surface and the side surface of the encapsulated light detector.

5. The optical module of claim 4, wherein the top surface of the encapsulated light detector is substantially horizontal, and the top surface and the side surface of the encapsulated light detector are substantially orthogonal.

6. The optical module of claim 1, wherein the molding compound exposes a portion of the surface of the carrier between the light source and the light detector, the light source and a portion of the molding compound surrounding the light source form an encapsulated light source, and the light detector and a portion of the molding compound surrounding the light detector form an encapsulated light detector;

and wherein a gap dimension at the surface of the carrier between the encapsulated light source and the encapsulated light detector is about 0.05 mm to about 0.5 mm.

7. The optical module of claim 1, wherein the light detector and a portion of the molding compound surrounding the light detector form an encapsulated light detector, and the at least one sloped structure is one sloped structure disposed on the encapsulated light detector.

8. The optical module of claim 1, wherein the at least one sloped structure is at least one chamfering.

9. The optical module of claim 1, wherein the at least one sloped structure is arcuate.

21. The optical module of claim 1, wherein the at least one sloped structure is positioned below the lid.

10. A process of manufacturing an optical module, comprising:

providing a carrier;

disposing at least one light source and at least one light detector adjacent to a surface of the carrier;

encapsulating the light source and the light detector by an encapsulant to form an encapsulated light source, and forming at least one sloped structure between a side surface and a top surface of the encapsulant, the at least one sloped structure comprising a sloped surface extended between a side surface and a top surface of the encapsulant; and

applying a lid surrounding the light source and the light detector, wherein a portion of the lid is positioned between the light source and the light detector.

11. The process of claim 10, further comprising forming a gap in the encapsulant between the light source and the light detector.

12. The process of claim 11, further comprising cutting the encapsulant to form the gap and expose the carrier between the light source and the light detector.

13. The process of claim 12, wherein the encapsulant and the light source together form an encapsulated light source, and the encapsulant and the light detector together form an encapsulated light detector spaced apart from the encapsulated light source by the gap, the at least one sloped structure includes a plurality of sloped structures, and wherein the sloped structures are disposed on the encapsulated light source and the encapsulated light detector.

14. The process of claim 12, wherein the encapsulant and the light detector together form an encapsulated light detector, and the at least one sloped structure is disposed between a top surface and a side surface of the encapsulated light detector.

15. The process of claim 10, wherein a light source and an adjacent light detector are an optical pair, there is a connecting portion of the carrier between two adjacent optical pairs, and the encapsulant is disposed on the connecting portion.

16. The process of claim 15, further comprising cutting the encapsulant on the connecting portion.

17. The process of claim 10, wherein a light source and an adjacent light detector are an optical pair, further comprising disposing a lid assembly on the surface of the carrier, and cutting the lid assembly and the carrier, to singulate a plurality of optical pairs.

18. The process of claim 10, wherein a light source and an adjacent light detector are formed as an optical pair, further comprising disposing a plurality of lids on the surface of the carrier, and cutting the carrier to singulate a plurality of optical pairs.

19. The process of claim 10, wherein the at least one sloped structure is formed by a mold.

20. The process of claim 10, wherein the at least one sloped structure is at least one chamfering.

22. The process of claim 10, wherein the encapsulated light source comprises a lens structure, and the lens structure is integral with the encapsulant.