Electrical device including a substrate and a transparent conductive layer and a process of forming the same

• US 10,509,291 B2
• Filed: 02/26/2018
• Issued: 12/17/2019
• Est. Priority Date: 02/27/2017
• Status: Active Grant

• Current Assignee: Sage Electrochromics, Inc (Compagnie de Saint-Gobain SA)
• Original Assignee: Sage Electrochromics, Inc (Compagnie de Saint-Gobain SA)
• Inventors: Sarrach, Sebastian Marius, Martin, Florent, Bjornard, Erik Jon
• Primary Examiner(s): Choi, William
• Application Number:
  US15/905,175
• Publication Number:
  US 20180252976A1
• Time in Patent Office: 659 Days
• Field of Search: 359265-275
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: G02F 1/15 based on an electrochromic effect
• CPC Class Codes: G02F 1/1508 using a solid electrolyte
• CPC Class Codes: G02F 1/1524 Transition metal compounds
• CPC Class Codes: G02F 1/15245 based on iridium oxide or hydroxide
• CPC Class Codes: G02F 1/153 Constructional details
• CPC Class Codes: G02F 1/1533 structural features not otherwise provided for
• CPC Class Codes: G02F 1/155 Electrodes
• CPC Class Codes: G02F 2001/1555 Counter electrode

Abstract

A stack of layers can be formed adjacent to a substrate before any layer within the stack is patterned. In an embodiment, combinations of substrates and stacks can be made and stored for an extended period, such as more than a week or a month, or shipped to a remote location before further manufacturing occurs. By delaying irreversible patterning until the closer to the date final product will be shipped to a customer, the likelihood of having too much inventory of a particular size or having to scrap windows for a custom order that was cancelled after manufacturing started can be substantially reduced. Further, particles between layers of the stack can be avoided. The process flows described are flexible, and many of the patterning operations in forming holes, openings, or the high resistance region can be performed in many different orders.

Claims

1. An electrical device comprising:

a first substrate;

a first transparent conductive layer; and

a second transparent conductive layer, wherein the first transparent conductive layer is disposed between the first substrate and the second transparent conductive layer,

wherein;

the first transparent conductive layer includes a first high resistance region; and

a first hole extends through at least the second transparent conductive layer, and from a top view, the first hole extends to the first high resistance region.

2. The electrical device of claim 1, further comprising:

an electrochromic device including;

a first electrode layer that is one of an electrochromic layer and an ion storage layer; and

a second electrode layer that is the other of the electrochromic layer and the ion storage layer,

wherein;

the first transparent conductive layer is disposed between the first substrate and the electrochromic device and is closer to the first electrode layer than to the second electrode layer;

the electrochromic device is disposed between the first and second transparent conductive layers;

the second transparent conductive layer is closer to the second electrode layer than to the first electrode layer;

an intermixed region includes a mixture of materials from the first transparent conductive layer and the first electrode layer; and

the second transparent conductive layer includes a portion that is intact and over or under the intermixed region.

3. The electrical device of claim 2, wherein the intermixed region is at least part of the first high resistance region.

4. The electrical device of claim 1, further comprising:

a first substrate;

a first transparent conductive layer;

an electrochromic device including;

a first electrode layer that is one of an electrochromic layer and an ion storage layer; and

a second electrode layer that is the other of the electrochromic layer and the ion storage layer; and

a second transparent conductive layer, wherein the first transparent conductive layer is disposed between the first substrate and second conductive transparent layer;

a first bus bar electrically connected to the first transparent conductive layer; and

a second bus bar electrically connected to the second transparent conductive layer, wherein;

(1) the first transparent conductive layer includes a first high resistance region, such that the first and second bus bars are not electrically connected to each other, and the electrical device has a feature including;

from a top view, the first high resistance region is spaced apart from the first and second bus bars;

the first bus bar has a length, and the first high resistance region has a length that is at least 2% of the length of the first bus bar;

or

any combination thereof; and

(2) the electrical device further comprises a strip of material, wherein the first high resistance region is disposed between the first substrate and the strip of material.

5. The electrical device of claim 4, wherein:

a second hole is spaced apart from the first hole by a space, extends through at least the second transparent conductive layer, and from a top view, the second hole overlies or underlies the first high resistance region;

a void corresponds to a particular portion of the first transparent conductive layer, the first electrode layer, or both removed from the space between the first and second holes; and

a portion of the second transparent conductive layer, the second electrode layer, or both are within the space and above the void.

6. The electrical device of claim 5, wherein the first hole has a width of at most 900 microns or at most 50 microns.

7. An electrical device comprising:

a first substrate;

a first transparent conductive layer including a first high resistance region;

a first electrode layer;

a second transparent conductive layer;

a second electrode layer; and

an intermixed region including a mixture of materials from the first transparent conductive layer and the first electrode layer;

wherein the first transparent conductive layer is disposed between the first substrate and the second transparent conductive layer;

wherein the first electrode layer is between the first transparent conductive layer and the second transparent conductive layer;

wherein the first electrode layer is one of an electrochromic layer and an ion storage layer;

wherein the second electrode layer is disposed between the first electrode layer and the second transparent conductive layer; and

wherein the second electrode layer is the other of the electrochromic layer and the ion storage layer.

8. The electrical device of claim 7, further comprising a strip of material, wherein the first high resistance region is disposed between the first substrate and the strip of material.

9. The electrical device of claim 7, wherein the second transparent conductive layer includes a portion that is intact and over or under the intermixed region.

10. The electrical device of claim 7, wherein the intermixed region is at least part of a first high resistance region.

11. The electrical device of claim 7, further comprising a first hole extending through at least the second transparent conductive layer, and from a top view, the first hole extends to the first high resistance region.

12. A process of forming an electrical device comprising:

providing a first substrate and a stack of layers adjacent to the first substrate, wherein the stack of layers includes;

a first transparent conductive layer;

a first electrode layer that is one of an electrochromic layer and an ion storage layer;

a second electrode layer that is the other of the electrochromic layer and the ion storage layer; and

a second transparent conductive layer,

wherein the first electrode layer is disposed between the first and second transparent conductive layers, and the second electrode layer is disposed between the first electrode layer and the second transparent conductive layer;

patterning the stack to define a first hole extending through at least the second transparent conductive layer; and

converting a portion of the first transparent conductive layer to a first high resistance region after patterning the stack to define the first hole.

13. The process of claim 12, wherein converting the portion of the first transparent conductive layer to the first high resistance region comprises:

applying pressure on the stack to convert the portion of the first transparent conductive layer to a first high resistance region.

14. The process of claim 12, wherein converting the portion of the first transparent conductive layer to the first high resistance region comprises:

along a side of the stack, changing a thermal gradient of at least a portion of the stack; and

along an opposite side of the stack, converting the portion of the first transparent conductive layer to the first high resistance region during or after changing the thermal gradient of the at least a portion the stack.

15. The process of claim 12, further comprising forming a laminate comprising the first substrate, a second substrate, and the stack of layers disposed between the first and second substrates, wherein converting the portion of the first transparent conductive layer to the first high resistance region is performed by introducing energy through the second substrate.

16. The process of claim 12, wherein converting the portion of the first transparent conductive layer is performed using a first laser that passes over or under the first hole.

17. The process of claim 16, wherein patterning the stack is performed using a second laser.

18. The process of claim 17, wherein converting the portion of the first transparent conductive layer is performed at a first laser energy density, and patterning the stack is performed at a second laser energy density that is greater than the first laser energy density.

19. The process of claim 12, further comprising:

determining a first layout for the first electrical device;

converting a first portion of the first transparent conductive layer to a first high resistance region within the first layout for the first electrical device after determining the first layout;

determining a second layout for the second electrical device; and

converting a second portion of the first transparent conductive layer to a second high resistance region within the second layout for the second electrical device after determining the second layout.