Low Dk/Df solder resistant composition use for printed circuit board
First Claim
1. A low dielectric constant (Dk)/dissipation factor (Df) solder resistant composition, comprising following components:
- A) a photopolymerizable prepolymer of formula (1), which is 20 to 70 weight %, wherein the photopolymerizable prepolymer of formula (1) is prepared by reacting (a) an epoxy resin with (b) a mono carboxylic acid including a vinyl group, then reacting with (c) a saturated or unsaturated anhydride;
wherein the epoxy resin is (a1) dicyclo pentadiene-phenol novolac multifunctional epoxy, or (a2) polyphenyl ether modified multifunctional epoxy resin or a combination thereof;
B) a photopolymerizable vinyl monomer which is 5 to 20 weight % and used as thinner;
C) an epoxy compound which is 5 to 30 weight %, the epoxy compound includes (C1) dicyclo pentadiene-phenol novolac multifunctional epoxy resin or polyphenyl ether modified epoxy resin or a combination thereof, and (C2) tetra methyl biphenol epoxy resin;
D) a photopolymerization initiator which is 2 to 10 weight %;
E) an inorganic filler which is 10 to 50 weight %;
F) a catalyst or accelerant which is 0 to 2.0 weight %;
G) an organic solvent which is 10 to 40 weight %;
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Accused Products
Abstract
A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition comprising (A) a photopolymerizable prepolymer of formula (1); (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent. The low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition has excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz);
10 Citations
9 Claims
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1. A low dielectric constant (Dk)/dissipation factor (Df) solder resistant composition, comprising following components:
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A) a photopolymerizable prepolymer of formula (1), which is 20 to 70 weight %, wherein the photopolymerizable prepolymer of formula (1) is prepared by reacting (a) an epoxy resin with (b) a mono carboxylic acid including a vinyl group, then reacting with (c) a saturated or unsaturated anhydride;
wherein the epoxy resin is (a1) dicyclo pentadiene-phenol novolac multifunctional epoxy, or (a2) polyphenyl ether modified multifunctional epoxy resin or a combination thereof;B) a photopolymerizable vinyl monomer which is 5 to 20 weight % and used as thinner; C) an epoxy compound which is 5 to 30 weight %, the epoxy compound includes (C1) dicyclo pentadiene-phenol novolac multifunctional epoxy resin or polyphenyl ether modified epoxy resin or a combination thereof, and (C2) tetra methyl biphenol epoxy resin; D) a photopolymerization initiator which is 2 to 10 weight %; E) an inorganic filler which is 10 to 50 weight %; F) a catalyst or accelerant which is 0 to 2.0 weight %; G) an organic solvent which is 10 to 40 weight %; - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification