Semiconductor memory device and method of manufacturing the same
First Claim
1. A semiconductor memory device, comprising:
- a memory cell array region including a plurality of conductive layers that are electrically connected to a plurality of memory cells arranged in a first direction on a semiconductor substrate, the first direction intersecting a surface of the semiconductor substrate;
a stepped part for contacting the plurality of conductive layers to a wiring line;
a contact extending in the first direction and being connected to the conductive layer in the stepped part; and
a plurality of columnar bodies extending in the first direction, each columnar body including a support column extending in the first direction, and each columnar body penetrating through the conductive layer in the stepped part, the plurality of columnar bodies including a first columnar body having an upper end on an opposite side to the substrate at a first height from the surface of the semiconductor substrate and a second columnar body having an upper end on an opposite side to the substrate at a second height from the surface of the semiconductor substrate, the second height being lower than the first height.
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Accused Products
Abstract
A semiconductor memory device according to an embodiment comprises: a memory cell array region including a plurality of conductive layers that are electrically connected to a plurality of memory cells arranged in a first direction on a semiconductor substrate, the first direction intersecting a surface of the semiconductor substrate; a stepped part for contacting the plurality of conductive layers to a wiring line; a contact extending in the first direction and being connected to the conductive layer in the stepped part; and a plurality of columnar bodies extending in the first direction and penetrates the conductive layer in the stepped part and including a first columnar body having a first height and a second columnar body having a second height which is lower than the first height.
4 Citations
12 Claims
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1. A semiconductor memory device, comprising:
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a memory cell array region including a plurality of conductive layers that are electrically connected to a plurality of memory cells arranged in a first direction on a semiconductor substrate, the first direction intersecting a surface of the semiconductor substrate; a stepped part for contacting the plurality of conductive layers to a wiring line; a contact extending in the first direction and being connected to the conductive layer in the stepped part; and a plurality of columnar bodies extending in the first direction, each columnar body including a support column extending in the first direction, and each columnar body penetrating through the conductive layer in the stepped part, the plurality of columnar bodies including a first columnar body having an upper end on an opposite side to the substrate at a first height from the surface of the semiconductor substrate and a second columnar body having an upper end on an opposite side to the substrate at a second height from the surface of the semiconductor substrate, the second height being lower than the first height. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification