Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
First Claim
Patent Images
1. A slurry comprising:
- abrasive grains; and
water, whereinthe abrasive grains include a hydroxide of a tetravalent metal element, and produce absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grains adjusted to 1.0 mass %.
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Abstract
A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, and produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %.
45 Citations
35 Claims
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1. A slurry comprising:
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abrasive grains; and water, wherein the abrasive grains include a hydroxide of a tetravalent metal element, and produce absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grains adjusted to 1.0 mass %. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 21, 22, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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11. A polishing liquid comprising:
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abrasive grains; an additive; and water, wherein the abrasive grains include a hydroxide of a tetravalent metal element, and produce absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grains adjusted to 1.0 mass %. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 23, 33, 34, 35)
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Specification