Thin film inductor and method of manufacturing the same

• US 10,553,346 B2
• Filed: 06/27/2017
• Issued: 02/04/2020
• Est. Priority Date: 11/01/2016
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Ryu, Joung Gul
• Primary Examiner(s): Bik Lian, Mang Tin
• Application Number:
  US15/634,523
• Publication Number:
  US 20180122554A1
• Time in Patent Office: 952 Days
• Field of Search: 336233, 336223, 336200, 296021, 29605, 29606
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/32 Insulating of coils, windings, or parts thereof
• CPC Class Codes: H01F 41/024 Manufacturing of magnetic circuits made from deformed sheets magnetic cores made from deformed sheets H01F27/2455
• CPC Class Codes: H01F 41/042 by thin film techniques
• CPC Class Codes: H01F 41/043 by thick film techniques
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material

Abstract

A method of manufacturing a thin film inductor includes preparing a carrier film having a first surface on which a first upper separation layer is formed and a second surface on which a first lower separation layer is formed. A first upper layer, including a first upper coil pattern and a first upper insulating pattern, is formed on the first surface. A first lower layer, including a first lower coil pattern and a first lower insulating pattern, is formed on the second surface. A surface of the first upper layer is ground. A height of the first lower coil pattern is smaller than that of the first lower insulating pattern.

Claims

1. A thin film inductor comprising:

an insulating part including a support member and having a central portion including a core formed of a magnetic material;

first and second coil patterns in the insulating part and electrically connected to each other by a via penetrating through an outer periphery of the support member, with the support member interposed therebetween;

a seed layer disposed between only portions of the second coil pattern and the support member, and spaced apart from the first coil pattern; and

upper and lower cover parts formed of the magnetic material and disposed on upper and lower portions of the insulating part, respectively,

wherein the first coil pattern contains conductive particles and a binder, and the second coil pattern and the via include a plating layer.

2. The thin film inductor of claim 1, wherein the support member has a thickness of 40 μ

m or less.

3. The thin film inductor of claim 1, wherein the second coil pattern has an aspect ratio of 5:

1 or more.

4. The thin film inductor of claim 1, wherein the second coil pattern has a height greater than that of the first coil pattern.

5. The thin film inductor of claim 1, wherein the first and second coil patterns contain copper.

6. The thin film inductor of claim 1, wherein the via and the second coil pattern have a same width.

7. A thin film inductor comprising:

an insulating part including a support member having a thickness of 40 μ

m or less and having a central portion including a core formed of a magnetic material;

first and second coil patterns in the insulating part and electrically connected to each other by a via penetrating through an outer periphery of the support member, with the support member interposed therebetween;

a seed layer disposed between only portions of the second coil pattern and the support member, and spaced apart from the first coil pattern; and

upper and lower cover parts formed of the magnetic material and disposed on upper and lower portions of the insulating part, respectively,

wherein the first coil pattern contains conductive particles and a binder, and the second coil pattern includes a plating layer, and

the first and second coil patterns and the support member are fully enclosed by the insulating part.

8. The thin film inductor of claim 7, wherein the second coil pattern has an aspect ratio of 5:

1 or more.

9. The thin film inductor of claim 7, wherein the second coil pattern has a height greater than that of the first coil pattern.

10. The thin film inductor of claim 7, wherein the first and second coil patterns contain copper.

11. A thin film inductor comprising:

an insulating part including a support member and having a central portion including a core formed of a magnetic material;

first and second coil patterns in the insulating part and electrically connected to each other by a via penetrating through an outer periphery of the support member, with the support member interposed therebetween;

a seed layer disposed between only portions of the second coil pattern and the support member, and spaced apart from the first coil pattern; and

upper and lower cover parts formed of the magnetic material and disposed on upper and lower portions of the insulating part, respectively,

wherein the first coil pattern contains conductive particles and a binder, and the second coil pattern includes a plating layer, and

the first and second coil patterns are made of different materials, and heights of the first and second patterns are different from each other.

12. The thin film inductor of claim 11, wherein the support member has a thickness of 40 μ

m or less.

13. The thin film inductor of claim 11, wherein the second coil pattern has an aspect ratio of 5:

1 or more.

14. The thin film inductor of claim 11, wherein the second coil pattern has a height greater than that of the first coil pattern.

15. The thin film inductor of claim 11, wherein the first and second coil patterns contain copper.