Die core for light guide plate, manufacturing method thereof, and light guide plate

• US 10,557,982 B2
• Filed: 06/05/2018
• Issued: 02/11/2020
• Est. Priority Date: 09/11/2017
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Hefei Boe Display Lighting Co., Ltd. (BOE Technology Group Co., Ltd.)
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Wu, Bo, Shi, Zuchuan
• Primary Examiner(s): Green, Tracie Y
• Application Number:
  US16/000,343
• Publication Number:
  US 20190079238A1
• Time in Patent Office: 616 Days
• CPC Class Codes: B29D 11/00663 Production of light guides
• CPC Class Codes: B29D 11/0073 Optical laminates
• CPC Class Codes: B32B 3/00 Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
• CPC Class Codes: G02B 6/0016 Grooves, prisms, gratings, scattering particles or rough surfaces
• CPC Class Codes: G02B 6/0028 Light guide, e.g. taper
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0043 provided on the surface of the light guide
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects
• CPC Class Codes: G02F 1/1336 Illuminating devices

Abstract

The present disclosure provides a die core for a light guide plate, a manufacturing method thereof, and the light guide plate. The manufacturing method includes steps of: providing a body, a to-be-processed surface of the body including a dot formation region and a dot-free region; forming dots at the dot formation region, the dots including protrusions and recesses; and forming a coverage layer at least covering the protrusions.

Claims

1. A method for manufacturing a die core for a light guide plate, comprising steps of:

providing a body, a surface of the body comprising a dot formation region and a dot-free region;

forming a sacrificial layer covering the surface;

forming dots at the dot formation region and removing the sacrificial layer on the dot formation region simultaneously, the dots comprising protrusions and recesses; and

forming a coverage layer at least covering the protrusions.

2. The method according to claim 1, wherein the step of forming the coverage layer at least covering the protrusions comprises forming the coverage layer covering all the dots.

3. The method according to claim 1, wherein

the step of forming the coverage layer at least covering the protrusions comprises forming the coverage layer at least covering the protrusions through an electroplating process;

and

subsequent to the step of forming the coverage layer at least covering the protrusions, the method further comprises removing the sacrificial layer at the dot-free region.

4. The method according to claim 3, wherein the step of forming the coverage layer at least covering the protrusions through an electroplating process comprises:

placing the body with the dots and an electroplating target into a tank containing an electroplating liquid;

enabling the body to be connected to a negative pole of a direct current source, enabling the electroplating target to be connected to a positive pole of the direct current source, and applying an electric signal to the body and the electroplating target through the direct current source; and

enabling metal cations in the electroplating liquid to be deposited onto the dots on the body under the effect of the electric signal to form the coverage layer at least covering the protrusions.

5. The method according to claim 2, wherein

the step of forming the coverage layer at least covering the protrusions comprises forming the coverage layer at least covering the protrusions through an electroplating process;

and

subsequent to the step of forming the coverage layer at least covering the protrusions, the method further comprises removing the sacrificial layer at the dot-free region.

6. The method according to claim 1, wherein

the coverage layer has a thickness of 1 μ

m to 3 μ

m;

a depth of each recess is within a range of 1.5 μ

m to 2.0 μ

m;

a height of each protrusion is within a range of 1.8 μ

m to 2.2 μ

m; and

a plane tangent to an outer wall of the coverage layer covering the protrusions is angled relative to a plane parallel to the surface at an angle of 75°

to 80°

.

7. The method according to claim 6, wherein the coverage layer covers the dot formation region;

a vertical distance between a top of the coverage layer on each protrusion and the surface of the body is within a range of 1.8 μ

m to 2.2 μ

m; and

a vertical distance between a bottom of the coverage layer on each recess and the surface of the body is within a range of 1.5 μ

m to 2.0 μ

m.