Device, system and method for automatic test of integrated antennas

• US 10,564,202 B2
• Filed: 06/27/2017
• Issued: 02/18/2020
• Est. Priority Date: 06/29/2016
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Schrattenecker, Jochen O., Frank, Oliver, Kaineder, Alexander
• Primary Examiner(s): Brainard, Timothy A
• Assistant Examiner(s): Pervin, Nuzhat
• Application Number:
  US15/634,588
• Publication Number:
  US 20180003754A1
• Time in Patent Office: 966 Days
• Field of Search: 342173
• CPC Class Codes: G01R 1/045 Sockets or component fixtures for RF or HF testing
• CPC Class Codes: G01R 29/10 Radiation diagrams of antennas
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G01R 31/302 Contactless testing G01R31/66 takes precedence
• CPC Class Codes: G01S 7/40 Means for monitoring or calibrating
• CPC Class Codes: G01S 7/4004 of parts of a radar system
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/3233 particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems

Abstract

A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.

Claims

1. A test set-up for testing a system-in package (SiP) with an integrated antenna, the test set-up comprises:

a carrier with an RF probe antenna arranged thereon; and

a test socket with resilient electric contacts, the test socket being mounted on the carrier and providing an electric contact to interconnects of the SiP when placed on the test socket,

wherein the test socket has an opening which is arranged superjacent to the RF probe antenna, the opening providing a passage through the test socket such that electromagnetic radiation emanating from the integrated antenna included in the SiP passes through the opening and reaches the RF probe antenna.

2. The test set-up of claim 1, further comprising:

a wafer chuck configured to receive the SiP.

3. The test set-up of claim 2,

wherein the wafer chuck is configured to place the SiP on the test socket such that the resilient electric contacts are electrically connected to the interconnects of the SiP.

4. The test-set-up of claim 1,

wherein the resilient electric contacts are formed by one of:

resilient pins, spring contacts, pogo-pins, needle contacts, electrically conductive elastomer contacts, and electrical lines formed on a membrane.

5. The test-set-up of claim 1,

wherein the carrier is a printed circuit board or a probe-card.

16. The test set-up of claim 1, wherein the RF probe antenna is formed in a layer of the carrier.

17. The test set-up of claim 1, wherein the opening in the test socket is a through hole positioned directly opposing the integrated antenna included in the SiP.

18. The test set-up of claim 1, wherein the RF probe antenna is arranged on the carrier parallel to the integrated antenna included in the SiP while the SiP is being tested.

19. The test set-up of claim 2, wherein the wafer chuck is configured to reflect the electromagnetic radiation emanating from the integrated antenna included in the SiP through the opening in the test socket to reach the RF probe antenna while the SiP is being tested.

6. A system for testing a system-in package (SiP) with an integrated antenna, the system comprises:

a wafer chuck configured to receive the SiP; and

an automatic test equipment including a carrier with an RF probe antenna arranged thereon and a test socket with resilient electric contacts mounted on the carrier;

wherein the wafer chuck is configured to place the SiP on the test socket so that the resilient electric contacts of the test socket provide an electric contact to interconnects of the SiP, and

wherein the test socket has an opening which is arranged superjacent to the RF probe antenna, the opening providing a passage through the test socket such that electromagnetic radiation emanating from the integrated antenna included in the SiP passes through the opening and reaches the RF probe antenna.

7. The system of claim 6,

wherein the automatic test equipment is configured to cause the SiP to generate an RF signal, which is radiated by the integrated antenna.

8. The system of claim 7,

wherein the automatic test equipment is configured to receive a measured signal provided by the RF probe antenna.

9. The system of claim 7,

wherein the distance between the SiP and the RF probe antenna is such that, for a given RF band including the RF signal, the RF probe antenna is in the near-field of the integrated antenna of the SiP.

10. The system of claim 8,

wherein the automatic test equipment is configured to calculate, based on the measured signal provided by the RF probe antenna, data representing a far-field pattern of the integrated antenna.

11. The system of claim 10,

wherein the automatic test equipment is configured to derive at least one parameter of the SiP or the integrated antenna from the calculated far-field data.

12. A method for testing a system-in package (SiP) with an integrated antenna, the method comprises:

placing the SiP on a test socket using a wafer chuck, the test socket being attached on a carrier and including resilient electric contacts that provide an electric contact to interconnects of the SiP;

using an RF probe antenna mounted on the carrier to obtain near-field measurements of an electromagnetic field emanating from the integrated antenna, the electromagnetic field extending through an opening in the test socket that is arranged superjacent to the RF probe antenna; and

calculating far-field data from the near-field measurements.

13. The method of claim 12 further comprising:

controlling, via the resilient electric contacts of the test socket, the SiP to generate an RF signal, which is supplied to the integrated antenna and causes the electromagnetic field.

14. The method of claim 12 further comprising:

calculating, based on the calculated far-field data, one or more parameters of the SiP or the integrated antenna or both.

15. The method of claim 14,

wherein the one or more parameters include at least one of the following:

EIRP, transmitted RF power, effective antenna gain, and system gain.