Tiny 6 pin side view surface mount LED

• US 10,615,324 B2
• Filed: 06/11/2014
• Issued: 04/07/2020
• Est. Priority Date: 06/14/2013
• Status: Active Grant

• Current Assignee: Cree Huizhou Solid State Lighting Company Limited (Smart Global Holdings Incorporated)
• Original Assignee: Cree Huizhou Solid State Lighting Company Limited (Smart Global Holdings Incorporated)
• Inventors: Chan, Chi Keung Alex, Lau, Yue Kwong Victor, Pang, Chak Hau Charles, Zhong, Zhenyu
• Primary Examiner(s): Ward, Eric A.
• Assistant Examiner(s): Ashbahian, Eric K
• Application Number:
  US14/302,113
• Publication Number:
  US 20140367712A1
• Time in Patent Office: 2,127 Days
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.

Claims

1. A light emitting device, comprising:

a package comprising a cavity with a floor;

a plurality of light emitting diodes (LEDs) mounted on said floor;

a plurality of contact pins in electrical contact with said plurality of LEDs, said plurality of contact pins protruding from a first side of said package;

a second side orthogonal to said first side and opposite a third side, in which at least a first and second of said plurality of contact pins are nearer said second side than said third side and confined to said first side and at least a third, fourth, and fifth of said plurality of contact pins are nearer said third side than said second side, wherein said third, fourth, and fifth pins are between said first and second pins on said first side and said LEDs disposed to emit light toward said second side; and

a plurality of bond pads on said floor to facilitate electrical connection between said LEDs and said plurality of contact pins, wherein at least one of said bond pads run along said floor without interruption, and wherein at least some of said bond pads have a tapered shape.

2. The light emitting device of claim 1, in which said plurality of contact pins comprise a mount surface such that said package is mountable to a surface, and wherein said LEDs are disposed to emit light in a direction parallel to said mount surface.

3. The light emitting device of claim 2, in which said mount surface is orthogonal to said floor.

4. The light emitting device of claim 1, in which said package further comprises an outer surface orthogonal to said floor, said outer surface comprising at least a sloped portion and a flat portion.

5. The light emitting device of claim 1, in which each of said LEDs emitting different wavelengths of light, said light emitting device capable of emitting a combination of said different wavelengths of light.

6. The light emitting device of claim 5, emitting a white light combination of said different wavelengths.

7. The light emitting device of claim 5, wherein said different wavelengths comprise red, green and blue wavelengths.

8. The light emitting device of claim 5, wherein said different wavelengths of light comprise blue and yellow wavelengths of light.

9. The light emitting device of claim 1, wherein said plurality of LEDs comprise three LEDs.

10. The light emitting device of claim 9, forming a three-color pixel.

11. The light emitting device of claim 1, wherein said plurality of LEDs comprise red, green and blue emitting LEDs.

12. The light emitting device of claim 1, said light emitting device emitting light with a correlated color temperature (CCT) in the range of 2,700 to 10,000K.

13. The light emitting device of claim 1, said light emitting device emitting light with a CCT of at least 4,500 to 8,000K.

14. The light emitting device of claim 1, further comprising a light diffuser.

15. The light emitting device of claim 1, further comprising an encapsulant with a light diffuser that physically scatters light passing through said encapsulant.