Systems and methods for utilizing DDR4-DRAM chips in hybrid DDR5-DIMMs and for cascading DDR5-DIMMs

  • US 10,628,343 B2
  • Filed: 02/03/2017
  • Issued: 04/21/2020
  • Est. Priority Date: 02/03/2017
  • Status: Active Grant
First Claim
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1. A hybrid double data rate 5 (DDR5) dual inline memory module (DIMM) comprising:

  • a printed circuit board (PCB);

    an edge connector of the PCB comprising a solitary DIMM external host interface, wherein the solitary DIMM external host interface is for only one DDR5 sub-channel;

    a plurality of DDR4 synchronous dynamic random access memory (SDRAM) chips mounted on the PCB and operatively coupled to the solitary DIMM external host interface; and

    a plurality of data-buffer chips and a registered clock driver (RCD) chip mounted on the PCB.

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