Laser cutting method, display substrate and display device

• US 10,632,569 B2
• Filed: 05/18/2015
• Issued: 04/28/2020
• Est. Priority Date: 12/25/2014
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Hsieh, Mingche, Xie, Chunyan, Liu, Lu, Wang, Hejin
• Primary Examiner(s): Thrower, Larry W
• Application Number:
  US14/906,373
• Publication Number:
  US 20160368101A1
• Time in Patent Office: 1,807 Days
• CPC Class Codes: B23K 2103/42 Plastics B23K2103/16 takes precedence
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/009 using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece using a mask on the workpiece B23K26/066
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/402 involving non-metallic material, e.g. isolators
• CPC Class Codes: B23K 26/702 Auxiliary equipment
• CPC Class Codes: B29C 2035/0838 using laser
• CPC Class Codes: B29C 2791/009 Using laser curing using laser B29C2035/0838, welding using laser beams B29C65/16
• CPC Class Codes: B29C 2793/0027 Cutting off
• CPC Class Codes: B29C 35/0805 using electromagnetic radiation
• CPC Class Codes: B29L 2011/00 Optical elements, e.g. lenses, prisms

Abstract

The present invention provides a laser cutting method, a display substrate and a display device. In the laser cutting method, the display substrate and the display device, as a cutting line is defined by two width defining dams on both sides of a region to be cut, the width of the cutting line can be adjusted by adjusting the distance between the two width defining dams. Thus, the width of the laser cutting line is controlled, and the effective use area of the substrate may be saved (and the material may be saved). Meanwhile, as the width defining dams are made of a laser reflective material, a laser beam irradiated onto the width defining dams is reflected without being absorbed by the width defining dams and thus transmitted to a corresponding region on the substrate. As a result, the generation of a carbonization region is avoided.

Claims

1. A laser cutting method, comprising steps of:

forming two width defining dams that are separated from each other on both sides of a region to be cut on a light incident surface of a substrate to be cut;

forming a cutting line between the two width defining dams; and

cutting the substrate to be cut along the cutting line by a laser;

wherein the two width defining dams are both made of a light reflective material.

2. The laser cutting method according to claim 1, wherein the sum of light absorptivity and light transmissivity of the light reflective material is less than or equal to 10%.

3. The laser cutting method according to claim 1, wherein light absorptivity of the substrate to be cut is greater than or equal to 80%.

4. The laser cutting method according to claim 1, wherein a distance between the two width defining dams is in the range of 1 μ

m to 5 μ

m.

5. The laser cutting method according to claim 1, wherein the two width defining dams are made of a light reflective metal material.

6. The laser cutting method according to claim 5, wherein the light reflective metal material comprises any one or more of gold, silver, aluminum, copper and nickel.

7. The laser cutting method according to claim 1, wherein a size, in a direction perpendicular to a surface having the two width defining dams thereon on the substrate to be cut, of each of the two width defining dams is in the range of 500 angstroms to 2000 angstroms.

8. The laser cutting method according to claim 1, wherein a size, in a direction parallel to a surface having the two width defining dams thereon on the substrate to be cut, of each of the two width defining dams is in the range of 2 μ

m to 10 μ

m.

9. The laser cutting method according to claim 1, wherein the two width defining dams are both formed by a patterning process.

10. The laser cutting method according to claim 1, wherein the substrate to be cut is made from an organic material.

11. The laser cutting method according to claim 10, wherein the organic material is any one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyether sulfone and polyimide.