Redirection of electromagnetic signals using substrate structures

  • US 10,651,559 B2
  • Filed: 01/06/2017
  • Issued: 05/12/2020
  • Est. Priority Date: 03/28/2012
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a substrate assembly of a printed circuit board (PCB), the substrate assembly comprising;

    a first conductive layer including an aperture,a second conductive layer parallel to, spaced from, and opposite the first conductive layer,a dielectric layer extending between the first and second conductive layers, anda plurality of electrically conductive components connected to and extending between the first and second conductive layers, the conductive components being spaced apart and distributed in the dielectric layer, the conductive components in combination with the first and second conductive layers together defining a waveguide extending through a portion of the dielectric layer; and

    a transducer to convert an electrical signal into extremely high frequency (EHF) radiation and to transmit the EHF radiation through a first end of the waveguide aligned with the aperture towards a second end of the waveguide, the transducer positioned outside the aperture and being a part of an integrated circuit (IC) package, the IC package mounted on an area of the PCB not overlapping with the waveguide.

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