Imaging sensor and imaging device with column ADC

• US 10,652,495 B2
• Filed: 05/01/2019
• Issued: 05/12/2020
• Est. Priority Date: 06/08/2012
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Murata, Hironobu
• Primary Examiner(s): Ye, Lin
• Assistant Examiner(s): Morehead, III, John H
• Application Number:
  US16/400,452
• Publication Number:
  US 20190260956A1
• Time in Patent Office: 377 Days
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H04N 25/70 SSIS architectures; Circuits associated therewith
• CPC Class Codes: H04N 25/75 Circuitry for providing, modifying or processing image signals from the pixel array
• CPC Class Codes: H04N 25/77 Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
• CPC Class Codes: H04N 25/772 comprising A/D, V/T, V/F, I/T or I/F converters

Abstract

An imaging sensor comprising: an imaging chip in which a plurality of pixel are arranged in a matrix; and a signal processing chip that is each provided for one or more pixel columns or one or more pixel rows, has a device that performs signal processing on a pixel signal output from a pixel, and is stacked with the imaging chip is provided. For example, the device that performs signal processing is an A/D converter that converts a pixel signal output from the pixel into a digital signal, and when a pixel signal output from the pixel is converted into a digital signal, at least two or more A/D converters among the A/D converters are controlled in parallel.

Claims

1. An imaging sensor comprising:

a pixel unit that has a plurality of pixels; and

a signal processing unit that has a first signal processing circuit that processes a signal output from a first pixel in the pixel unit, and is stacked on the pixel unit, wherein

the first signal processing circuit is arranged at a position that does not overlap the first pixel,

a first output interconnection, to which the first pixel outputs a signal, is connected to the first signal processing circuit via a first connection unit that is provided outside a region in which the plurality of pixels of the pixel unit are arranged, and electrically connects the pixel unit and the signal processing unit,

the signal processing unit has a second signal processing circuit that processes a signal output from a second pixel in the pixel unit, the second pixel being different from the first pixel,

the first signal processing circuit is arranged at a position that overlaps the second pixel, and the second signal processing circuit is arranged at a position that overlaps the first pixel, and

a second output interconnection, to which the second pixel outputs a signal, is connected to the second signal processing circuit via a second connection unit that is provided outside the region in which the plurality of pixels of the pixel unit are arranged, and electrically connects the pixel unit and the signal processing unit.

2. The imaging sensor according to claim 1, wherein

the first connection unit and the second connection unit are provided at locations such that the first connection unit and the second connection unit sandwich the region in which the plurality of pixels of the pixel unit are arranged.

3. The imaging sensor according to claim 2, wherein

the first connection unit is provided at a location that is closer to the first signal processing circuit than the second signal processing circuit, and

the second connection unit is provided at a location that is closer to the second signal processing circuit than the first signal processing circuit.

4. The imaging sensor according to claim 1, wherein

the first connection unit and the second connection unit are through-silicon vias that electrically connect the pixel unit and the signal processing unit.

5. The imaging sensor according to claim 1, wherein

the first signal processing circuit is a first A/D converter that converts a signal output from the first pixel into a digital signal, and

the second signal processing circuit is a second A/D converter that converts a signal output from the second pixel into a digital signal.

11. An imaging device comprising the imaging sensor according to claim 1.

6. An imaging sensor comprising:

a pixel unit that has a first area in which a plurality of pixels connected to a first control line are arranged, the first control line controlling a readout of a signal; and

a signal processing unit that has a first signal processing circuit that processes a signal output from a first pixel in the first area, and is stacked on the pixel unit, wherein

the first signal processing circuit is arranged at a position that does not overlap the first area,

a first output interconnection, to which the first pixel outputs a signal, is connected to the first signal processing circuit via a first connection unit that is provided outside a region in which the plurality of pixels of the pixel unit are arranged, and electrically connects the pixel unit and the signal processing unit,

the pixel unit has a second area in which a plurality of pixels connected to a second control line are arranged, the second control line controlling a readout of a signal that is different from the first control line,

the first signal processing circuit processes a signal output from a second pixel of the second area,

the signal processing unit has a second signal processing circuit that processes a signal output from a third pixel in the first area and a signal output from a fourth pixel in the second area, the third pixel being different from the first pixel, the fourth pixel being different from the second pixel,

the first signal processing circuit is arranged at a position that overlaps the first area, and the second signal processing circuit is arranged at a position that overlaps the second area,

the second pixel outputs a signal to the first output interconnection, and

a second output interconnection, to which the third pixel and the fourth pixel output signals, is connected to the second signal processing circuit via a second connection unit that is provided outside the region in which the plurality of pixels of the pixel unit are arranged, and electrically connects the pixel unit and the signal processing unit, the second connection unit being different from the first connection unit.

7. The imaging sensor according to claim 6, wherein

the first connection unit and the second connection unit are provided at locations such that the first connection unit and the second connection unit sandwich the region in which the plurality of pixels of the pixel unit are arranged.

8. The imaging sensor according to claim 7, wherein

the first connection unit is provided at a location that is closer to the first signal processing circuit than the second signal processing circuit, and

the second connection unit is provided at a location that is closer to the second signal processing circuit than the first signal processing circuit.

9. The imaging sensor according to claim 6, wherein

the first connection unit and the second connection unit are through-silicon vias that electrically connect the pixel unit and the signal processing unit.

10. The imaging sensor according to claim 6, wherein

the first signal processing circuit is a first A/D converter that converts signals output from the first pixel and the second pixel into digital signals, and

the second signal processing circuit is a second A/D converter that converts signals output from the third pixel and fourth pixel into digital signals.

12. An imaging device comprising the imaging sensor according to claim 6.