Method for manufacturing flat liquid crystal display device film

• US 10,656,446 B2
• Filed: 01/16/2017
• Issued: 05/19/2020
• Est. Priority Date: 12/29/2016
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Yue, Shouzhen, Zhang, Mengmeng
• Primary Examiner(s): McPherson, John A
• Application Number:
  US15/329,372
• Publication Number:
  US 20180341131A1
• Time in Patent Office: 1,219 Days
• Field of Search: 430 7, 430314, 430315, 430318, 430319, 430321, 349110
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G03F 7/168 Finishing the coated layer, e.g. drying, baking, soaking
• CPC Class Codes: G03F 7/2022 Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• CPC Class Codes: G03F 7/30 Imagewise removal using liquid means
• CPC Class Codes: H01L 27/1288 employing particular masking sequences or specially adapted masks, e.g. half-tone mask

Abstract

Disclosed is a method for manufacturing a flat liquid crystal display device film. According to the method for manufacturing the flat liquid crystal display device film, influence of a wiring thickness on topography of array film can be reduced. Without affecting a qualified rate of a product, a low-resistance wiring can be realized, and thus an RC delay during signal transmission of a large-sized panel can be reduced. Meanwhile, when the method is applied, a metal layer with a larger thickness relative to that of a metal layer made by a conventional method can be made. Therefore, wiring load of a large-sized panel can be reduced, resistance of signal line can be reduced. RC delay can be decreased, and display quality can be improved.

Claims

1. A method for manufacturing a flat liquid crystal display device film, comprising steps of:

step A, coating a negative photoresist layer on a substrate, and exposing the negative photoresist layer with a liquid crystal display device film mask to obtain a negative photoresist layer after exposing procedure which covers the substrate;

step B, developing the negative photoresist layer after exposing procedure, and forming a space having a shape defined by a liquid crystal display device film in the negative photoresist layer after developing procedure which covers an upper surface of the substrate;

step C, coating a negative photoresist protection layer on the surface of the negative photoresist layer after developing procedure and the surface of the space having the shape defined by the liquid crystal display device film;

step D, sputtering and growing a liquid crystal display device film on a surface of the negative photoresist layer after developing procedure and a surface of the space having the shape defined by the liquid crystal display device film, so that the liquid crystal display device film covers the surface of the negative photoresist layer after developing procedure, and meanwhile covers the surface of the space having the shape defined by the liquid crystal display device film;

step E, coating a positive photoresist layer on a surface of the liquid crystal display device film, so that the positive photoresist layer covers the surface of the liquid crystal display device film, and fills the space having the shape defined by the liquid crystal display device film;

step F, exposing the positive photeresist layer with a liquid crystal display device film mask, and developing the positive photeresist layer, to obtain a positive photeresist layer after developing procedure which is embedded in the space having the shape defined by the liquid crystal display device film of the liquid crystal display device film; and

step G, etching excess liquid crystal display device film with a photoresist pattern mask to obtain the flat liquid crystal display device film.

2. The method according to claim 1, wherein in step G, the flat liquid crystal display device film is embedded in the space having the shape defined by the liquid crystal display device film of the negative photoresist layer after developing procedure and is flush with the negative photoresist layer after developing procedure.

3. The method according to claim 1, wherein in step A, a thickness of the negative photoresist layer coated therein is from 1.0 to 1.5 times a thickness of the liquid crystal display device film.

4. The method according to claim 1, wherein in step D, the liquid crystal display device film is sputtered and grown on a surface of the negative photoresist layer after developing procedure and a surface of the space having the shape defined by the liquid crystal display device film which are both covered with a negative photoresist protection layer, so that the liquid crystal display device film covers the surface of the negative photoresist layer after developing procedure and the surface of the space having the shape defined by the liquid crystal display device film which are both covered with the negative photoresist protection layer.

5. The method according to claim 1, wherein a thickness of the negative photoresist protection layer is in a range from 0.1 to 0.2 μ

m.

6. The method according to claim 1, wherein the negative photoresist protection layer is made of silicon nitride or silicon oxide.

7. The method according to claim 1, wherein the flat liquid crystal display device film is made of one selected from a group consisting of metal M1, metal M2 and black matrix (BM).

8. The method according to claim 1, wherein the substrate is a glass substrate or a plastic substrate.