Chip-on-board modular lighting system and method of manufacture

  • US 10,670,250 B2
  • Filed: 12/20/2018
  • Issued: 06/02/2020
  • Est. Priority Date: 12/22/2017
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a chip-on-board (COB) assembly including;

    a thermally conductive plate, anda COB light-emitting diode (LED) device including a plurality of LED chips disposed on a surface of a substrate, the substrate including first electrical power contacts exposed from at least the surface,the COB LED device being thermally coupled to the thermally conductive plate; and

    an electronics board having second electrical power contacts, the electronics board being attached to the COB assembly with the first and second electrical power contacts electrically coupled and the electronics board disposed on the thermally conductive plate and at least partially covering the surface of the substrate of the COB LED.

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