Chip-on-board modular lighting system and method of manufacture

• US 10,670,250 B2
• Filed: 12/20/2018
• Issued: 06/02/2020
• Est. Priority Date: 12/22/2017
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Inventors: Bonne, Ronald
• Primary Examiner(s): Cariaso, Alan B
• Application Number:
  US16/228,022
• Publication Number:
  US 20190195479A1
• Time in Patent Office: 530 Days
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 23/004 arranged on a substrate, e.g. a printed circuit board
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 23/02 the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/50 Cooling arrangements air-treatment systems dissipating or using the heat of lighting fixtures F24F3/056
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/10 Controlling the intensity of the light
• CPC Class Codes: H05B 45/12 using optical feedback
• CPC Class Codes: H05B 45/18 using temperature feedback
• CPC Class Codes: H05B 45/325 Pulse-width modulation [PWM]
• CPC Class Codes: H05B 45/37 Converter circuits
• CPC Class Codes: H05B 47/18 via data-bus transmission
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/1025 : Metallic discs small solder preforms other than balls H05K2203/0415
• CPC Class Codes: H05K 2201/10568 : Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 7/20509 : Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly including a thermally conductive plate and a COB light-emitting diode (LED) device thermally coupled to the thermally conductive plate. The COB LED device includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts exposed from at least the surface. The system further includes an electronics board that has second electrical power contacts. The electronics board is attached to the COB assembly such that the first and second electrical contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.

Claims

1. A system comprising:

a chip-on-board (COB) assembly including;

a thermally conductive plate, and

a COB light-emitting diode (LED) device including a plurality of LED chips disposed on a surface of a substrate, the substrate including first electrical power contacts exposed from at least the surface,

the COB LED device being thermally coupled to the thermally conductive plate; and

an electronics board having second electrical power contacts, the electronics board being attached to the COB assembly with the first and second electrical power contacts electrically coupled and the electronics board disposed on the thermally conductive plate and at least partially covering the surface of the substrate of the COB LED.

2. The system of claim 1, wherein the COB LED device is attached to a central region of the thermally conductive plate.

3. The system of claim 1, further comprising an aperture formed in the thermally conductive plate and having a shape conforming to a shape of the COB LED device substrate, the COB LED device being fitted within the aperture such that a light emitting region, formed at least partially by the plurality of LED chips, extends above a surface of the thermally conductive plate to which the electronics board is attached.

4. The system of claim 3, further comprising an aperture formed in a central region of the electronics board through which the light emitting region at least partially extends.

5. The system of claim 1, further comprising a plurality of electronic elements disposed on the electronics board, the plurality of electronic elements including at least one of a dimmer interface circuit, one or more direct current (DC)-DC converter circuits, a conductivity and control module and an alternating current (AC)-DC converter circuit.

6. The system of claim 1, further comprising an optical holder attached to the electronics board.

7. The system of claim 6, wherein the optical holder includes at least one support structure configured for attachment of at least one of an optical reflector, a lens system, a light guide, a protective transparent plate, a colored glass, and a plastic plate.

8. The system of claim 1, further comprising at least one active or passive cooling element disposed on or adjacent to the thermally conductive plate.

9. A system comprising:

a plurality of chip-on-board (COB) light-emitting diode (LED) device sub-systems, each of the plurality of COB LED device sub-systems comprising;

a COB assembly including a thermally conductive plate and a COB LED device thermally coupled to the thermally conductive plate, the COB LED device including a plurality of LED chips disposed on a surface of a substrate, the substrate including first electrical power contacts exposed from at least the surface,

an electronics board having second electrical power contacts, the electronics board being attached to the COB assembly with the first and second electrical power contacts electrically coupled and the electronics board disposed on the thermally conductive plate and at least partially covering the surface of the substrate of the COB LED, and

a direct current (DC) voltage interface configured to receive a DC voltage from a single external DC power supply.

10. The system of claim 9, further comprising dimmer interface circuitry configured to receive a DC voltage from a single external dimmer actuator.

11. The system of claim 10, wherein each of the plurality of COB LED device sub-systems further comprises individual dimmer interface circuits electrically coupled to the single external dimmer actuator.

12. The system of claim 9, wherein the COB LED device of each of the COB LED device sub-systems is attached to a central region of the respective thermally conductive plate.

13. A method of assembling a chip-on-board (COB) light-emitting diode (LED) device system, the method comprising:

providing a COB LED device that includes a plurality of LED chips disposed on a surface of a substrate, the substrate including first electrical power contacts exposed from at least the surface;

thermally coupling the COB LED device to a thermally conductive plate to form a COB assembly;

providing an electronics board having second electrical power contacts;

positioning the electronics board relative to the COB assembly such that the first and second electrical power contacts are aligned;

soldering together the first and second electrical power contacts; and

attaching the thermally conductive plate to the electronics board with the electronics board disposed on the thermally conductive plate and at least partially covering the surface of the substrate of the COB LED.

14. The method of claim 13, wherein the attaching the thermally conductive plate to the electronics board comprises attaching the thermally conductive plate to the electronics board using an adhesive.

15. The method of claim 13, wherein the thermally coupling the COB LED device to the thermally conductive plate comprises attaching the COB LED device to a central region of the thermally conductive plate.

16. The method of claim 13, wherein the provided thermally conductive plate comprises an aperture having a shape that conforms to a shape of the COB LED device substrate, and the positioning includes fitting the COB LED device within the aperture such that a light emitting region, formed at least partially by the plurality of LED chips, extends above a surface of the thermally conductive plate to which the electronics board is attached.

17. The method of claim 16, wherein the electronics board further comprises an aperture formed in a central region thereof, the method further comprising at least partially extending the light emitting region through the aperture formed in the central region of the electronics board.

18. The method of claim 13, further comprising attaching an optical holder to the electronics board.

19. The method of claim 13, further comprising providing electronic elements on the electronics board, the electronic elements including at least one of a dimmer interface circuit, one or more direct current (DC)-DC converter circuits, a conductivity and control module and an alternating current (AC)-DC converter circuit.

20. The method of claim 13, further comprising providing at least one active or passive cooling element on or adjacent to the thermally conductive plate.