Wearable infrared temperature sensing device

• US 10,670,465 B2
• Filed: 11/16/2018
• Issued: 06/02/2020
• Est. Priority Date: 03/20/2015
• Status: Active Grant

• Current Assignee: PixArt Imaging Incorporated
• Original Assignee: PixArt Imaging Incorporated
• Inventors: Sun, Chih-Ming, Tsai, Ming-Han, Tsai, Cheng-Nan
• Primary Examiner(s): Allen, Andre J
• Application Number:
  US16/194,212
• Publication Number:
  US 20190086267A1
• Time in Patent Office: 564 Days
• Field of Search: 374 1-210
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: G01J 5/0265 Handheld, portable ear thermometers G01J5/049
• CPC Class Codes: G01J 5/041 Mountings in enclosures or in a particular environment
• CPC Class Codes: G01J 5/045 Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements getter arrangements per se H01L23/26 and H01L21/3221
• CPC Class Codes: G01J 5/06 Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.

Claims

1. A wearable device, comprising:

a case having a first opening; and

a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including;

an assembly structure;

a sensor chip which is disposed on the assembly structure;

a filter structure which is disposed above the sensor chip; and

a metal shielding structure which is disposed on the assembly structure and surrounds the sensor chip and the filter structure, wherein the metal shielding structure has a second opening to expose the filter structure.

2. The wearable device as claimed in claim 1, wherein the far infrared temperature sensing device further comprises:

a circuit substrate disposed in the case; and

a waterproof structure disposed in the first opening of the case;

wherein the waterproof structure is used to enclose the case.

3. The wearable device as claimed in claim 1, wherein the sensor chip is electrically connected to the assembly structure by at least one wire.

4. The wearable device as claimed in claim 2, wherein the waterproof structure is an infrared passing structure.

5. The wearable device as claimed in claim 1, wherein the assembly structure is disposed on the circuit substrate.

6. The wearable device as claimed in claim 1, wherein the sensor chip is configured to detect a far infrared which has a wavelength ranging from 15 to 1000 μ

m.

7. The wearable device as claimed in claim 1, wherein the filter structure is configured to allow the far infrared to pass through.

8. The wearable device as claimed in claim 1, wherein the metal shielding structure is configured to block the noise generated from other sensors and external electronic products, and prevent other far infrared from passing into the case.

9. The wearable device as claimed in claim 1, wherein the case is a watch case of a smartwatch, the assembly structure is a SMD substrate or a CLCC substrate, and the sensor chip is a far infrared sensor chip.

10. The wearable device as claimed in claim 2, wherein the circuit substrate is a PCB and the waterproof structure is a waterproof glue or a waterproof layer.